Skip to main content
Search jobs

Thermal Management and Design Engineer

Toronto, Ontario, Canada Job ID JR0262132 Job Category Platform Hardware and Systems Engineering Work Mode Hybrid Experience Level Entry Level Full/Part Time Full Time

Job Description

Do Something Wonderful!

Intel put the Silicon in Silicon Valley. No one else is this obsessed with engineering a brighter future. Every day, we create world changing technology that enriches the lives of every person on earth. So, if you have a big idea, let’s do something wonderful together. Join us, because at Intel, we are building a better tomorrow.

Intel desires entry into market segments served by high performance discrete graphics. Participation in such market segments requires the delivery of reference platforms to downstream customers with sufficient confidence to ramp the design, or a very close derivative, into high volume production quickly. Intel is building this capability and now seeks to expand its discrete graphics Platform Engineering team. Are you interested? Then XPE has an opportunity for you. In XPE, we are responsible for delivering leading GPU solutions for integrated and discrete graphics across market segments, and will continue to deliver a pipeline of innovation, to support the complete Intel platform, including CPU, memory, and accelerators. We are looking for a Thermal Management and Design engineer to join our team.

As a Thermal Management and Design Engineer in XPE you will:

  • Architect, simulate, validate thermal management and fan control features for Intel dGPU products.

  • Design and optimize high performance thermal solutions and overall platform designs, for Intel dGPU cards and systems.

  • Utilize your knowledge to influence upstream, internal, and external teams (firmware, software, driver, etc.) to ensure from thermal and acoustic perspectives, the product meets requirements. This entails an understanding of thermal management and fan control architecture, familiarity with the interaction of all components of thermal control.

  • Be aware of typical industry thermal mechanical technologies and concerns and be keen to explore new technologies to further push the envelope and become an industry leader in thermal performance. You should be proficient in documenting your work and communicating with design partners or high-level management.

  • Work in collaboration with engineers from all competencies of the system engineering team (mechanical, PCB layout, board design, power design, etc.), the program management team, and teams outside of system engineering (software, etc.) to ensure products are delivered to both technical and schedule requirements.

  • In addition, you may work with key OEM/ODM partners or customers in support of their designs.

The Thermal Management and Design Engineer should possess the following behavioral traits.

  • Well organized, with good written and oral communication skills.

  • Passionate about innovation and end to end ownership.

  • Comfort with change and change management, as well as team collaboration with sites worldwide.

  • Strong written and oral communication skills.

  • Detail oriented and able to express technical ideas and initiatives clearly in writing or by presentation.


This is an entry level position and will be compensated accordingly.

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience.

What we need to see (Minimum Qualifications):
Bachelor of Science degree in Mechanical Engineering, or related STEM degree.

  • 1+ years experience applying the fundamentals of heat transfer and fluid dynamics

  • 1+ years of experience with thermal debug/analysis

How to Stand out (Preferred Qualifications):

  • Bachelor of Science degree in Mechanical Engineering or related field with 3+ years relevant experience or a Master of Science in Mechanical Engineering or related field and 1+ years of relevant experience.

  • 2+ years of experience with heat sink fundamentals in the PC eco-system

  • 2+ years of experience testing high performance thermal mechanical solutions for electronics applications (air cooled and/or liquid cooled)

  • 2+ years of experience with the tradeoffs between thermal and other design parameters (mechanical, electrical, etc.).

  • 1+ years experience with thermal management and fan control testing/debugging

  • 1+ years of working with thermal simulation software such as Icepak or Flotherm

  • 1+ years of experience working with PCIe, OAM or other desktop or server form factors.

  • 1+ years of experience 3D Modelling experience with software such as Creo/ProE or SolidWorks.

Inside this Business Group

The Client Computing Group (CCG) is responsible for driving business strategy and product development for Intel's PC products and platforms, spanning form factors such as notebooks, desktops, 2 in 1s, all in ones. Working with our partners across the industry, we intend to deliver purposeful computing experiences that unlock people's potential - allowing each person use our products to focus, create and connect in ways that matter most to them. As the largest business unit at Intel, CCG is investing more heavily in the PC, ramping its capabilities even more aggressively, and designing the PC experience even more deliberately, including delivering a predictable cadence of leadership products. As a result, we are able to fuel innovation across Intel, providing an important source of IP and scale, as well as help the company deliver on its purpose of enriching the lives of every person on earth.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.


We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.

Intel is committed to a culture of accessibility. Intel provides accommodations to applicants and employees with disabilities. Find information and request accommodation here.

Annual Salary Range for jobs which could be performed in Canada:CAD 77,610.00-116,390.00
Salary range dependent on a number of factors including location and experience

Working Model

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.
Maggie, Offensive Security Researcher

Maggie Offensive Security Researcher

“I’ve always wanted to do something that changes the world — at Intel, I feel appreciated, and I’ve gained more confidence in myself. It makes me feel like I’m capable of doing great things.”

  • Analog Layout Design Engineer Multiple Locations View job
  • Liquid Industrial Waste Systems Technician - Kiryat Gat Kiryat Gat, Israel View job
  • Senior Software Engineer for the Intel AI Solutions Group Petah Tikva, Israel View job
View all jobs

You don't have Recently Viewed Jobs yet.

View all jobs

You don't have Saved Jobs yet.

View all jobs

Join Our Talent Community

Be the first to hear about what's happening at Intel! Sign up to receive the latest news and updates.

Sign up