PROCESS INTEGRATION - YIELD ENGINEER

Ho Chi Minh City, Ho Chi Minh, Vietnam Job ID JR0263828 Job Category Manufacturing and Process Development Work Mode On-site Required Experience Level Experienced Full/Part Time Full Time

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Job Description

Defines roadmaps to meet requirements, goals and milestones for incoming technology transfer.
Defines and establishes flow, procedures, and equipment configuration for the module.
Extracts insights from structured and unstructured data by quickly synthesizing large volumes of data, and applying statistics and machine learning, and may using coding techniques (e.g. SQL, python, etc.) primarily, but could also include programming languages (i.e. .net).
Owns sustaining and continuous improvement of quality and integrated defect and parametric measurements in startup and high volume manufacturing environment.
Drives low yield analysis and yield improvement activities with both internal and external stakeholders.
Ensures continuous improvement programs are in place to prevent quality, line yield, and sort yield excursions.
Performs quality and reliability risk assessments for potentially discrepant manufacturing material as well as for process changes.
As a senior principal engineer, recognized as a domain expert who sets, influences, and drives technical direction across Intel and industry.
Develops and mentors others, grows the technical community, acts as a change agent, and role models Intel values. Aligns organizational goals with technical vision, formulates technical strategy to deliver leadership solutions, and demonstrates a track record of relentless execution in bringing products and technologies to market.

Qualifications

Candidate requires a Bachelor's degree in Science or any related engineering degree.
Having 3-5 year's experience in Outsource Electronics Packaging Industry is highly preferred.
Candidate with strong leadership attributes, proven strong communication and stakeholder management skills.
Knowledgeable in structured problem-solving method, strong data driven mindset.
Proficiency with Data Analytics or AI/ML related field.
Having Silicon-to-Electronics-packaging interaction knowledge is a plus for the candidate.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.

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Working Model

This role will require an on-site presence.

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Maggie Offensive Security Researcher

“I’ve always wanted to do something that changes the world — at Intel, I feel appreciated, and I’ve gained more confidence in myself. It makes me feel like I’m capable of doing great things.”