Skip to main content
Search jobs

LTD Principal Engineer - Front End or Back End Process Integration

Hillsboro, Oregon, United States Job ID JR0262906 Job Category Platform Hardware and Systems Engineering Work Mode Hybrid Experience Level Experienced Full/Part Time Full Time
Apply

Job Description


About the Group:

The Foundry Technology Development (TD) Group, the heart and soul of Moore’s Law at Intel, is responsible for the research, development, and deployment of next-generation silicon and packing technologies that will enable future Intel and Foundry customer products. The Logic Technology Development (LTD) team in TD, delivers programs and modules to ramp new process nodes, supports high volume manufacturing (HVM) and provides a predictable technology cadence for Intel customers.

About the Role:

This LTD Semiconductor Process Integration Principal Engineer on Front End or Back End is responsible for defining key technology enabling technology or leading complex projects with programs with internal and external partners in delivering process technology innovation to establish Intel’s process leadership.

As a process integration expert and technologist, you will be responsible for customization and addition of new features to base technologies in large volume manufacturing. Your expertise will primarily focus on either FEOL or BEOL integration to add active and passive circuit elements to support compute, analog, RF, automotive and other wide-ranging applications for our customers.

Responsibilities:

  • Develop and enable semiconductor logic technologies for foundry customer use, focusing on embedded features for range of applications.
  • Collaborate with cross-functional teams to understand customer requirements and translate them into tailored solutions.
  • Provide leadership and expertise in the FEOL (FinFET) or BEOL (Low-k/Cu) integration.
  • Drive the development and implementation of customized, cost-effective, competitive, semiconductor logic technologies, ensuring compatibility with Intel's existing manufacturing processes and platforms.
  • Provide technical guidance and mentorship to junior engineers and researchers, fostering a culture of continuous learning and development.
  • Stay updated with industry trends, emerging technologies, and customer needs to inform customization strategies and identify opportunities for improvement.

Required Experience

  • Process Integration experience on Front End or Back End
  • Experience in device engineering, transistor enhancement or product debug.
  • Understanding of manufacturing processes and platforms and cost issues.

Preferred Experience:

  • Experience in Yield Improvement and High-Volume Manufacturing.
  • Experience in Power-performance optimization.

Qualifications


  • MS or PhD in electrical engineering, Physics, Material Science or a related field
  • 11+ years of experience in the semiconductor industry

Inside this Business Group


As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.


Posting Statement


All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits


We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.


Working Model


This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.

Position of Trust
This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.
Apply
Maggie, Offensive Security Researcher

Maggie Offensive Security Researcher

“I’ve always wanted to do something that changes the world — at Intel, I feel appreciated, and I’ve gained more confidence in myself. It makes me feel like I’m capable of doing great things.”

  • Research Intern Multiple Locations View job
  • Integrated Circuit (IC) Design Graduate Trainee Kulim, Malaysia View job
  • Silicon Packaging Design Engineer Multiple Locations View job
View all jobs

You don't have Recently Viewed Jobs yet.

View all jobs

You don't have Saved Jobs yet.

View all jobs

Join Our Talent Community

Be the first to hear about what's happening at Intel! Sign up to receive the latest news and updates.

Sign up