Process Integration and Yield Engineer
Job Description
Intel Dalian Memory Technology and Manufacturing (DMTM) is high-volume manufacturing memory fab in Intel China working on leading edge 3D NAND product. Intel and SK Hynix have an agreement for SK Hynix to acquire Intel's NAND memory and storage business. and Intel will continue to manufacture NAND wafers at the Dalian memory manufacturing until the final closing expected to occur in March 2025. Intel DMTM will continue to build on the success of our NAND technology at a greater scale, play a larger role in supporting our customers.
NonVolatile Memory Device and Integration engineers are responsible for leading research and development in order to architect, develop and deliver leading edge nonvolatile memory technologies to high volume manufacturing. They contribute to defining process and device architectures, technology collaterals as well as develop scaling paths for leading edge memory technologies. The scope includes development of new types of process and device architectures involving novel materials, structures and integration schemes to deliver industry leadership in density, performance, reliability and cost. They collaborate with technology development partners in defining goals, developing the vision, aligning strategy and driving fast paced silicon development to meet aggressive technology node cadences. In addition they work closely with the product and system teams to ensure seamless integration of the memory components into Intel's system products as well as with the manufacturing Fabs to ensure a seamless technology transfer and ramp to support the full envelope of component and system products.
This position is associated with the sale of Intel's NAND memory and storage business to SK. This transaction will enhance the resources and potential of the business' storage, and you will be joining a world-class team that will transition to lead the SSD business at SK group. We will keep you informed updates and steps related to this transaction.
Qualifications
Hold a MS or PhD in Electrical Engineering Materials Science Physics Chemistry or Chemical Engineering relevant major Minimum 2 years of direct experiences in integration device defect reduction yield analysis or process engineering organizations is required Direct experience in 3D NAND technology development transfer ramping and sustaining are preferred A proven history of technical problem solving through the creation of solutions that demonstrated creativity and out of box thinking Excellent data extraction and analysis skills and well versed in DOE principles Understanding of device physics in deciphering parametric data and understanding of fundamental integration and yield issues for key modules and critical device parameters are required Understand defect metrology tool work principle capability inline detection challenge and have thoughts on opportunities Demonstrating advanced understanding of electrical testing and device characterization and physics Ability to multitask and be effective in providing timely solutions Strong organizational and communication skills to manage tasks across Process Engineering areas to effectively execute and commit to deliverables.Inside this Business Group
Employees in Intel's NAND Product Group deliver solutions that are transforming computing across all segments from data centers to Ultrabooks. They invent, develop, bring to market and support customers with leading-edge NAND flash memory and system level solutions such as solid state drives (SSDs). SSDs are accelerating performance for gaming enthusiasts, reducing total cost of ownership for IT managers of data centers and improving security and reliability for businesses. This dynamic group is strategically positioned to become the leading Non-Volatile Memory solution supplier for the compute segment and is a key to expanding markets and continuing the growth for Intel.Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.Working Model
This role will require an on-site presence.Maggie Offensive Security Researcher
Ich wollte schon immer etwas tun, das die Welt verändert – bei Intel fühle ich mich geschätzt und ich habe mehr Selbstvertrauen gewonnen. Die Arbeit gibt mir das Gefühl, dass ich in der Lage bin, Großes zu leisten.
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