Thermal-Mechanical Engineer
Job Description
We are seeking a dynamic individual to join the DCAI's Custom Design Engineering (CDE) team as a Sr. Mechanical/Thermal Engineer. This individual will be part of a larger a cross functional Architecture/Engineering team (i.e. Board/ System, Mechanical, Thermal, SI/PI/PD, etc.) responsible for Co-Engineering Custom Design Systems with strategic customers.
Additionally, this person will be a contributor in CDE's Thermal/Mechanical Center of Excellence (CoE) - defining/driving/bringing to market new platform level innovations and solutions that proactively addresses Thermal/Mechanical issues our CSPs face, integrate Intel's Adjacent Technologies/Solutions (i.e., Networking, MCR, AI/Machine Learning, etc.), and drive new mechanical and/or thermal innovations that push next level performance within the CSP's environment.
Responsibilities will include but not be limited to:
- Architect, model, and design mechanical solutions that meet both internal and external requirements at the data center, rack, system, board, and component level.
- Provide/deliver 3D CAD models for both system and board level floor-planning and to analyze engineering trade-offs with the rest of the cross functional team.
- Thermal modeling/analysis of platform applications that provide high confidence thermal performance in all CSP environments.
- Create new mechanical and/or thermal innovations that address our customer's top problem statements, and enable higher performance on Intel solutions (fail, learn, succeed).
- Work with internal stakeholders to be the CSP voice/feedback loop to the greater Intel (i.e., improve current and future TMDGs, educate CSP challenges and roadblocks, etc.).
- Analyze both mechanical and thermal test/validation data and correlate to modeling.
Qualifications
Minimum Qualifications, are required to be initially considered for this position:
- The candidate must have a bachelor's degree in Mechanical engineering or related STEM field.
5+ years of experience in:
- Mechanical engineering, 3D CAD modeling, heat transfer, thermal engineering, and test/validation techniques of said solutions.
- 3D CAD modeling tools (i.e., Solidworks, or Pro\Engineer-Creo).
- System or Platform design relating to passive and active (forced air and liquid) thermal solutions.
- Advanced English level.
The position is in Mexico, it is not eligible for employment-based visa/immigration sponsorship.
Preferred Qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates:
- Master of Science degree with 3+ years of industry experience, or PhD degree in Mechanical Engineering or related field.
- Manufacturing processes including Injection Molding, Extrusions, Sheet Metal and CNN would be an added advantage.
- Broad thermal engineering with exposure in thermal simulation tools Flotherm or IcePak.
Inside this Business Group
The Data Center & Artificial Intelligence Group (DCAI) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.Working Model
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.Maggie Offensive Security Researcher
Zawsze chciałam robić coś, co będzie zmieniać świat — w firmie Intel czuję się doceniona i nabrałam większej pewności siebie. Czuję, że jestem w stanie robić wspaniałe rzeczy.
- Physical Design Engineer Hillsboro, Oregon Aplikuj teraz
- SOC Design Engineer San José, Kostaryka Aplikuj teraz
- Process Steward Wiele lokalizacji Aplikuj teraz
Nie masz jeszcze zapisanych ofert pracy.
Zobacz wszystkie oferty pracyDołącz do naszej Społeczności Talentów
Bądź pierwszą osobą, która dowie się o tym, co dzieje się w Intelu! Zapisz się, by otrzymywać najnowsze wiadomości i aktualizacje.
-
Manufacturing at Intel
Our Manufacturing Technicians are critical to Intel and the future of technology. They are responsible for the setup, maintenance and performance of the complex machinery that build semiconductors—powering nearly everything in our daily lives. Whether you are right out of school, transitioning military, returning to the workforce or looking for a place that values your skills and expertise, we have a place for you at Intel.
-
Life at Intel
We've created an inclusive, supported environment...and we can't wait for you to be a part of it.
-
Learn More About the Semiconductor Industry
Semiconductors—otherwise known as microchips, microprocessors, or chips—are the brains behind some of the most innovative technology today and power so many of the things we use in our daily lives. There’s a big demand for them—and for the talented people who help bring this critical technology to life.
-
Intel to Receive Up to $8.5 Billion Through the CHIPS Act
Proposed funding, coupled with an investment tax credit and eligibility for CHIPS Act loans, would help Intel advance American semiconductor manufacturing and technology leadership in the AI era.
-
Intel Opens Fab 9 in New Mexico
Intel celebrated the opening of Fab 9, its cutting-edge factory in Rio Rancho, New Mexico. The milestone is part of Intel's previously announced $3.5 billion investment to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies.
-
The World’s First Systems Foundry
Intel launched Intel Foundry on February 21, 2024, as a more sustainable systems foundry business designed for the AI era. An expanded process roadmap was announced to establish leadership into the latter part of this decade.