Skip to main content
Szukaj ofert

MOLBEOL Process Integration Engineer

Dalian, Liaoning Sheng, Chiny Identyfikator oferty JR0268525 Kategoria Manufacturing and Process Development Tryb pracy Wymagany na miejscu Poziom doświadczenia Doświadczony Wymiar etatu Praca na pełny etat
Aplikuj

Job Description


DMTM is looking for candidates who will grow into process integration PI engineering roles reporting to Integration Managers. As a PI engineer you will be responsible for leading teams of technical contributors in enablement of next generation nonvolatile memory integration schemes to support 3DNAND density and performance scaling. Candidates should have relevant previous experience demonstrating sustained creativity in problem solving and technology innovation and able to work across organizations to influence technology development. Successful applicants are expected to perform feasibility studies and provide integrated process solutions to meet desired safety quality reliability and output requirements for ultimate transfer to high volume manufacturing.

The position is associated with the sale of the NAND business to SK Hynix aligning to Phase 2 of the transaction. Employees aligned to Phase 2 will continue to be employed by Intel developing NAND technology and components. Phase 2 of the transaction is expected to close in March 2025 at which time employees aligned to this phase of the transaction will transition employment to Solidigm, a stand-alone US subsidiary of SK Hynix headquartered in San Jose, California with offices world-wide. Solidigm is a leading global supplier of NAND flash memory solutions, led by Robert (Rob) B. Crooke as CEO, previously senior vice president and general manager of Intel's Non-Volatile Memory Solutions Group. To read more, see: https://www.intc.com/news-events/press-releases/detail/1513/intel-sells-ssd-business-and-dalian-facility-to-sk-hynix


Qualifications


Qualifications � BS MS or PhD in a science or engineering discipline � Minimum 3 years of experience in semiconductor research development andor manufacturing � Demonstrated technical leadership and a track record of creative problem solving and innovation � Handson experiences in technology development technology transfer andor technology startup � Strong expertise in process characterization qualification and troubleshooting � Direct experience in silicon process technology development Preferred Qualifications � Motivated selfstarter with ability to work independently as well as in a team environment � Verbal and written communication skills in English � Think and operate independently while simultaneously focusing on many diverse priorities � Flexibility and maturity in facing uncertainties and changing prioritiesresponsibilities � Commit to aggressive goals and win with a cando attitude � Act with velocity and a sense of urgency � Respect cultural diversity and sensitivity � Agility in learning improving and innovating

Inside this Business Group


Employees in Intel's NAND Product Group deliver solutions that are transforming computing across all segments from data centers to Ultrabooks. They invent, develop, bring to market and support customers with leading-edge NAND flash memory and system level solutions such as solid state drives (SSDs). SSDs are accelerating performance for gaming enthusiasts, reducing total cost of ownership for IT managers of data centers and improving security and reliability for businesses. This dynamic group is strategically positioned to become the leading Non-Volatile Memory solution supplier for the compute segment and is a key to expanding markets and continuing the growth for Intel.


Posting Statement


All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits


We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.


Working Model


This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change...
Aplikuj
Maggie, Offensive Security Researcher

Maggie Offensive Security Researcher

Zawsze chciałam robić coś, co będzie zmieniać świat — w firmie Intel czuję się doceniona i nabrałam większej pewności siebie. Czuję, że jestem w stanie robić wspaniałe rzeczy.
  • Account Executive Telco and Next Wave CSP Paryż, Francja Aplikuj teraz
  • Mfg Automation Service Desk Site Reliability Engineer (SRE) Kulim, Malezja Aplikuj teraz
  • Platform Information System Engineer Kulim, Malezja Aplikuj teraz
Zobacz wszystkie oferty pracy

Nie masz jeszcze ostatnio wyświetlanych ofert pracy.

Zobacz wszystkie oferty pracy

Nie masz jeszcze zapisanych ofert pracy.

Zobacz wszystkie oferty pracy

Dołącz do naszej Społeczności Talentów

Bądź pierwszą osobą, która dowie się o tym, co dzieje się w Intelu! Zapisz się, by otrzymywać najnowsze wiadomości i aktualizacje.

Zapisz się