DMTM CMOS PI Engineer
Job Description
Dalian 3D NAND DMTM is looking for a CMOS Integration engineer candidate. As a PI engineer, you will be responsible to enable current and next generation non-volatile memory CMOS segment integration schemes, and 3D-NAND CMOS density and performance scaling.
Responsibilities include, but are not limited to:
- Plan lot split table for yield, performance improvement.
- Setup lot DOE in MES and monitor lot movement with planned schedule. Setup new production process flow, setup new operation.
- Work closely with process owner for process improvement, SPC chart review, new recipe request Review design, post-gen data, DRC violation.
- Define CD monitor structure Summarize inline SPC chart, defect report, param test electrical data.
- Work closely with yield enhancement team for yield issue solution. Provide instruction to setup param test program.
- Setup request for param data collection.
The position is associated with the sale of the NAND business to SK Hynix aligning to Phase 2 of the transaction. Employees aligned to Phase 2 will continue to be employed by Intel developing NAND technology and components. Phase 2 of the transaction is expected to close in March 2025 at which time employees aligned to this phase of the transaction will transition employment to Solidigm, a stand-alone US subsidiary of SK Hynix headquartered in San Jose, California with offices world-wide. Solidigm is a leading global supplier of NAND flash memory solutions, led by Robert (Rob) B. Crooke as CEO, previously senior vice president and general manager of Intel's Non-Volatile Memory Solutions Group. To read more, see: https://www.intc.com/news-events/press-releases/detail/1513/intel-sells-ssd-business-and-dalian-facility-to-sk-hynix
Qualifications
Minimum Qualifications: Candidate must possess a PhD with 3+yrs experience or Masters degree with 5+yrs experience in a relevant field such as Electrical Engineering, Materials Science and Engineering, Chemical Engineering, Physics or other similar technical degree. Preferred Qualifications: 3+ years of experience in the following: Logic process integration or device engineering Param analysis/report NAND process integration engineering Familiar with process characterization, qualification, troubleshooting and probe yield improvement Familiar with characterization techniques such as SEM, TEM, EDX, SIMS etc. Statistical design of experiments, SPC, PCS methodology, data analysis skills and experience with JMP, SQL PF, Python, Catalyst etc In-depth knowledge of device physics, parametric test structures, and probe sort data. Familiar with CAD tools and software for test structure layout review Hands-on experiences in technology development, technology transfer and/or technology startup. Strong commitment in work and flexible in working timeInside this Business Group
Employees in Intel's NAND Product Group deliver solutions that are transforming computing across all segments from data centers to Ultrabooks. They invent, develop, bring to market and support customers with leading-edge NAND flash memory and system level solutions such as solid state drives (SSDs). SSDs are accelerating performance for gaming enthusiasts, reducing total cost of ownership for IT managers of data centers and improving security and reliability for businesses. This dynamic group is strategically positioned to become the leading Non-Volatile Memory solution supplier for the compute segment and is a key to expanding markets and continuing the growth for Intel.Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.Working Model
This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change...Maggie Offensive Security Researcher
Zawsze chciałam robić coś, co będzie zmieniać świat — w firmie Intel czuję się doceniona i nabrałam większej pewności siebie. Czuję, że jestem w stanie robić wspaniałe rzeczy.
- Account Executive Telco and Next Wave CSP Paryż, Francja Aplikuj teraz
- Mfg Automation Service Desk Site Reliability Engineer (SRE) Kulim, Malezja Aplikuj teraz
- Platform Information System Engineer Kulim, Malezja Aplikuj teraz
Nie masz jeszcze zapisanych ofert pracy.
Zobacz wszystkie oferty pracyDołącz do naszej Społeczności Talentów
Bądź pierwszą osobą, która dowie się o tym, co dzieje się w Intelu! Zapisz się, by otrzymywać najnowsze wiadomości i aktualizacje.
-
Manufacturing at Intel
Our Manufacturing Technicians are critical to Intel and the future of technology. They are responsible for the setup, maintenance and performance of the complex machinery that build semiconductors—powering nearly everything in our daily lives. Whether you are right out of school, transitioning military, returning to the workforce or looking for a place that values your skills and expertise, we have a place for you at Intel.
-
Life at Intel
We've created an inclusive, supported environment...and we can't wait for you to be a part of it.
-
Learn More About the Semiconductor Industry
Semiconductors—otherwise known as microchips, microprocessors, or chips—are the brains behind some of the most innovative technology today and power so many of the things we use in our daily lives. There’s a big demand for them—and for the talented people who help bring this critical technology to life.
-
Intel to Receive Up to $8.5 Billion Through the CHIPS Act
Proposed funding, coupled with an investment tax credit and eligibility for CHIPS Act loans, would help Intel advance American semiconductor manufacturing and technology leadership in the AI era.
-
Intel Opens Fab 9 in New Mexico
Intel celebrated the opening of Fab 9, its cutting-edge factory in Rio Rancho, New Mexico. The milestone is part of Intel's previously announced $3.5 billion investment to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies.
-
The World’s First Systems Foundry
Intel launched Intel Foundry on February 21, 2024, as a more sustainable systems foundry business designed for the AI era. An expanded process roadmap was announced to establish leadership into the latter part of this decade.