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NAND Collateral DTCO Engineer

Dalian, Liaoning Sheng, Chiny Identyfikator oferty JR0271244 Kategoria Manufacturing and Process Development Tryb pracy Wymagany na miejscu Poziom doświadczenia Doświadczony Wymiar etatu Praca na pełny etat
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Job Description


Intel Dalian Memory Technology and Manufacturing (DMTM) is high-volume manufacturing memory fab in Intel China working on leading edge 3D NAND product. Intel and SK Hynix have an agreement for SK Hynix to acquire Intel's NAND memory and storage business. and Intel will continue to manufacture NAND wafers at the Dalian memory manufacturing until the final closing expected to occur in March 2025. Intel DMTM will continue to build on the success of our NAND technology at a greater scale, play a larger role in supporting our customers.

Owns critical high volume manufacturing equipment and processes that enable rapid device miniaturization and the mass production of integrated circuits. Conducts tests and measurements of their operations to ensure control over critical dimensions and defectivity of the process line. Recommends and implements modifications for operating the equipment in order to improve production efficiencies, manufacturing techniques and optimizing production output for existing products, to meet safety, quality and cost indicator goals. Grows insitu manufacturing capacity to high volumes to demonstrate the technology capability while simultaneously transferring the technology to counterparts in manufacturing sites across the globe. Owns execution of maintenance and repair activities for equipment and relevant module of components. Initiates and owns the continuous improvement of equipment and process for key performance indicators (e.g., safety, quality, cost, productivity, defects, and yield) and works with equipment suppliers as required. Owns process development line items aligned to high volume process nodes. Participates in the transfer of technology to other sites through training and audit of installation and qualification outcomes to ensure matched processing across sites. Owns development and optimization of excursion prevention systems for the equipment and process. Owns detection of discrepant material or activities of the equipment and process. During factory ramps, owns equipment install/conversion and qualification to ensure tools are installed safely and on schedule, while meeting all quality/matching criteria (from design through Safety Level 1 and Safety Level Supplier milestones, Intel qual and manufacturing readiness processes).


Qualifications


Technical Qualifications -- MS, or PhD in a science or engineering field and minimum 1 years of experience in semiconductor research, development or manufacturing environment are required.--Demonstrated technical leadership and a track record of problem solving with creativity and out-of-box thinking;--Direct experiences in technology development, transfer or startup are required, a leader role experience is preferred;--Strong expertise of semiconductor device and fab process flow, process/design qualification and troubleshooting is required;--Direct hands-on experience on one or multiple of relevant areas is highly desired such as Process integration/Device, PDK, DTCO/PPA, Litho process, OPC/Mask/Tapeout, TCAD, Metrology, Fab process(Etch, Thinfilm, Implant and CMP etc.).--Familiar with standard EDA tools(Cadence Virtuoso, Mentor Calibre, Synopsys S-Litho, etc), scripting capability is a plus.Other Qualifications--Motivated self-starter, with strong ability to work independently as well as in a team environment;--Strong verbal and written communication skills in English;--Think and operate independently, while simultaneously focusing on many diverse priorities;--Flexibility and maturity in facing uncertainties and changing priorities/responsibilities;--Commit to aggressive goals and win with a can-do attitude;--Act with velocity and a strong sense of urgency;--Respect cultural diversity and sensitivity;--Agility in learning, improving, and innovating.

Inside this Business Group


Employees in Intel's NAND Product Group deliver solutions that are transforming computing across all segments from data centers to Ultrabooks. They invent, develop, bring to market and support customers with leading-edge NAND flash memory and system level solutions such as solid state drives (SSDs). SSDs are accelerating performance for gaming enthusiasts, reducing total cost of ownership for IT managers of data centers and improving security and reliability for businesses. This dynamic group is strategically positioned to become the leading Non-Volatile Memory solution supplier for the compute segment and is a key to expanding markets and continuing the growth for Intel.


Posting Statement


All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits


We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.


Working Model


This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.
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