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Test Chip Engineering Technical Lead

Pulau Pinang, 马来西亚 職位 ID JR0270230 職位類別 Software Engineering 工作模式 Hybrid 經驗級別 Experienced 工时类型 全職
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Job Description


This position is within the Design Technology Platform (DTP) organization of Intel Technology Development (TD) group. We are looking for a talented individual to join Test Chip Engineering (TCE) team to execute Test Chip design from early pathfinding to maturity on advanced silicon technology nodes and enable diverse DTP teams to contribute targeted test structures through design automation and collateral support. The team involves in the following activities: Designs, develops, tests, and debugs software tools, flows, and methodologies used in design automation and by teams in the design of hardware products, process design, or manufacturing. Responsibilities include capturing user stories/requirements, writing both functional and test code, automating build and deployment, and/or performing unit, integration, and end to end testing of the software tools in the physical design domain. #designtechnologyplatform #designenablement

Qualifications


You must possess the below requirements to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications - Bachelor Degree (Masters Degree preferred) in Electrical Engineering, Computer Engineering, Computer Science, or other related field of study. - 10+ years of relevant experience in layout design and/or Tool Flow Methodology (TFM) development - 5+ years of proven experience in managing teams with a strong record of delivery. Experience in tracking and reporting project progress. - 5+ years' experience in technical problem solving. Experience in the following areas: - Use of industry Layout editing and verification CAD tools - Strong in programming, e.g. Python, SKILL, etc. - Successfully led one or more design tape-outs using advanced foundry nodes. - Able to provide technical guidance and support to team members throughout the project cycle. - Excellent verbal communication, technical presentation and leadership skills. Self-motivated and well organized. #designtechnologyplatform #designenablement

Inside this Business Group


As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.


Posting Statement


All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits


We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.


Working Model


This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
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