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Senior Hardware Engineer

圣克拉拉, 加利福尼亚州, 美国 職位 ID JR0269589 職位類別 Platform Hardware and Systems Engineering 工作模式 On-site Required 經驗級別 Experienced 工时类型 全職
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Job Description


The team is seeking an experienced Hardware Designer for the development of PIC sub-system, reference pluggable optical module boards and Optical Compute Interconnect (OCI) test boards to support product development.

The candidate will be expected to collaborate with a cross functional product development team - HW, FW, PIC, EIC, Packaging and thermal, Optics and NPI.

Job Responsibilities:

  • Support and lead hardware design of an optical transceiver and evaluation boards meeting product specifications, including schematic capture, circuit simulation, PCB design guidance, DFM review and design verification testing.
  • Expertise in designing 100G/lane and 200G/lane module PCBA, own the schematic and layout execution, require extensive experience with designing PDN for high-speed DSP, RFICs, manage PI and SI requirements, actively guide layout engineer, and manage tradeoffs in design.
  • Extensive experience with selection of DSP, Driver, TIA, uControllers, DACs, ADCs, Voltage regulators, etc.
  • Key contributor to Product Requirements, Owns PCBA design from concept phase to full final design and EVT/DVT phase of the product.
  • Understand electrical and optical requirements and specifications of optical transceiver MSA. Like 800G DR8/2xFR4, 1.6T DR8/2xFR4, 800G LPO, 1.6T LRO etc.
  • Maintain documentation of a hardware design specification, Pass design check list prior to tape out, BOM specifications and work with NPI team to build PCBA.
  • Lead design reviews and present design summary to management, highlight risks with mitigation plans.
  • Interface and work collaboratively with mechanical engineers, optical engineers, Photonics engineer, firmware engineers, process engineers and test engineers.
  • Design and coordinate with PI/SI engineer to simulate high-speed interfaces, RF traces, etc. 100Gbps, 200Gbps NRZ and PAM4 signaling.
  • Interact with program manager, buyer/planner, and suppliers to make sure designed parts are available in a timely manner for build.
  • Troubleshooting and performance optimization of the sub-system/transceiver module board

The ideal candidate will exhibit the following professional traits:

  • Communication and presentation skills.
  • Strong background of digital communication theory
  • Familiarity with industry standards including IEEE Ethernet standards, OIF standards, PCIe standards and various MSAs.


Qualifications


Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

  • M.S. in Electrical Engineering..
  • 5+ years of HW/circuit design experience

5+ years of experience in:

  • High speed analog and digital circuit design skills and layout with mixed signal designs.
  • Architecting floor plan in layout and able to direct layout engineer with clear design priority
  • High density multiple-layer board design.
  • Working with high volume PCB/substrate fab houses.
  • Thermal and EMI management.
  • Electronics CAD tools and electronic system modeling.
  • Principals of micro-controller and communication protocols such as SPI, I2C, MDIO.
  • Working with AWG, DCAM, VNA/LCA to characterize high speed performance
  • Laboratory optical and electrical measurement skills.

Preferred Qualifications:

  • Ph.D. is considered and asset
  • Knowledge of transceiver electrical design principles, including high speed signal integrity, crosstalk, power integrity, noise, soft start, ESD, FW, testing, etc.
  • Experience working with Marvell, Broadcom, MaxLinear, Credo DSPs in pluggable optical modules.
  • Expertise in RF design using modeling tools such as HFSS, ADS.
  • Experience with optical transceiver test and calibration methodologies.


Inside this Business Group


The Data Center & Artificial Intelligence Group (DCAI) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.


Posting Statement


All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits


We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.



Annual Salary Range for jobs which could be performed in the US $123,139.00-$203,801.00
*Salary range dependent on a number of factors including location and experience


Working Model


This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.
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