Collateral Litho OPC Engineer

Job Description

Intel Dalian Memory Technology and Manufacturing (DMTM) is high-volume manufacturing memory fab in Intel China working on leading edge 3D NAND product. Intel and SK Hynix have an agreement for SK Hynix to acquire Intel's NAND memory and storage business. and Intel will continue to manufacture NAND wafers at the Dalian memory manufacturing until the final closing expected to occur in March 2025. Intel DMTM will continue to build on the success of our NAND technology at a greater scale, play a larger role in supporting our customers.

This job requisition looks for candidates for the positions of Collateral Litho OPC Engineer, with work location in Dalian, China, reporting to Litho Process Engineering Manager. The selected candidates will be responsible for activities covering OPC development/optimization, DFM, and mask optimization, coordinating weakspot disposition among design collateral, process, and PI teams, as well as reticle and frame change define and review. Candidates must have demonstrated a track record of excellence in creative problem solving, process and integration capability enabling, enhancement or design for manufacturability optimization in a relevant engineering organization. Responsibilities include:--Perform feasibility study and provide integrated design/process/patterning solutions to meet desired device specification and process requirements.— Through assessment, simulation, and validation, define and design OPC/SMO/Patterning scheme for NAND layer structure and/or evaluate/qualify software platforms to meet technology, yield, and cost needs of new processes. – Lead new fab litho driven pattern optimization project with OPC/DFM solution and new mask tapeout, implement for both TD and high volume manufacturing readiness. The position is associated with the sale of the NAND business to SK Hynix aligning to Phase 2 of the transaction. Employees aligned to Phase 2 will continue to be employed by Intel developing NAND technology and components. Phase 2 of the transaction is expected to close in March 2025 at which time employees aligned to this phase of the transaction will transition employment to Solidigm, a stand-alone US subsidiary of SK Hynix headquartered in San Jose, California with offices world-wide. Solidigm is a leading global supplier of NAND flash memory solutions, led by Robert (Rob) B. Crooke as CEO, previously senior vice president and general manager of Intel's Non-Volatile Memory Solutions Group.

This position is associated with the sale of Intel's NAND memory and storage business to SK. This transaction will enhance the resources and potential of the business' storage, and you will be joining a world-class team that will transition to lead the SSD business at SK group. We will keep you informed updates and steps related to this transaction.

Qualifications

Technical Qualifications--BS, MS, or PhD in a science or engineering field and minimum 3 years of experience in semiconductor research, development or manufacturing environment are required.--Demonstrated technical leadership and a track record of problem solving with creativity and out-of-box thinking;--Direct experiences in technology development, transfer or startup are required, a leader role experience is preferred;--Strong expertise of semiconductor device and fab process flow, process/design qualification and troubleshooting is required;--Direct hands-on experience on one or multiple of relevant areas is highly desired such as OPC/Mask/Tapeout/Litho simulation/Process integration/Device, Design rule, Litho process, Metrology, Dry etch, and CMP.--Familiar with standard EDA tools(Cadence Virtuoso, Mentor Calibre, Synopsys S-Litho, etc), scripting capability(Python/SVRF/Shell) is a plus. Other Qualifications--Motivated self-starter, with strong ability to work independently as well as in a team environment;--Strong verbal and written communication skills in English;--Think and operate independently, while simultaneously focusing on many diverse priorities;--Flexibility and maturity in facing uncertainties and changing priorities/responsibilities;--Commit to aggressive goals and win with a can-do attitude;--Act with velocity and a strong sense of urgency;--Respect cultural diversity and sensitivity;--Agility in learning, improving, and innovating.

Inside this Business Group

Employees in Intel's NAND Product Group deliver solutions that are transforming computing across all segments from data centers to Ultrabooks. They invent, develop, bring to market and support customers with leading-edge NAND flash memory and system level solutions such as solid state drives (SSDs). SSDs are accelerating performance for gaming enthusiasts, reducing total cost of ownership for IT managers of data centers and improving security and reliability for businesses. This dynamic group is strategically positioned to become the leading Non-Volatile Memory solution supplier for the compute segment and is a key to expanding markets and continuing the growth for Intel.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.

Working Model

This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.