Heterogeneous Platforms Lab Research Intern

Join Intel Labs as a Heterogeneous Platforms Lab Research Intern. Intel Labs is responsible for driving cutting-edge research in breakthrough technologies to fuel Intel's product pipeline. Our mission is to identify, explore, and innovate on pioneering technologies and high-risk opportunities ahead of business unit investment, demonstrating proof-of-concept prototypes while maturing nascent technologies for high-volume market deployment. This internship focuses on innovating hardware and software technologies that will transform the AI computing experience across edge/cloud systems.

In this role, your responsibilities will include:  

• Conduct research in emerging trends driving heterogeneous integration, die disaggregation/2.5D/3D stacking, distributed computing, chiplet design, inter-chiplet interfaces, and heterogeneous IPs.

• Analyze emerging AI workloads and design compute/memory blocks.

• Build hardware prototypes and proof-of-concepts with advanced packaging.

• Collaborate with development teams to derive infrastructure design requirements, build, test, and automate tools.

• Partner with leading thinkers in academia, industry, and government, and work closely with Intel business units.

• Assist in the design and implementation of experiments to evaluate the performance of heterogeneous computing platforms.

• Analyze data and present findings to the research team, contributing to the development of technical reports and publications.

• Participate in brainstorming sessions and contribute innovative ideas to advance research objectives.

You must possess the below minimum education requirements and minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:  

• Pursuing a Ph.D. degree in Computer Engineering, Electronics Engineering, Computer Science, or a STEM-related field.

6+ months of work or educational experience in the following areas:

• 2.5D/3D stacking, chiplet-based systems.

• Generative AI/Transformer models, emerging AI/workloads characterization, edge computing architectures.

• Complementary Metal-Oxide Semiconductor (CMOS) chip design.

• Software expertise in C++/Perl/Python and experience in (micro)architecture simulators and/or system software.

Preferred Qualifications/Experience:

• Hands-on experience working with generative AI/transformer models

• Multi-die stacking, 3D integration technology, interface circuits, and lab measurements.

• VLSI design and/or accelerator-based (micro)architecture.

• ML architecture, software pipelines, and programming models.

• Emerging AI workloads characterization and workload-driven architecture.