Skip to main content
Tìm Kiếm

DSS Collateral Device Engineer

Dalian, Liaoning Sheng, Trung Hoa ID Công việc JR0268561 Ngành nghề Manufacturing and Process Development Chế độ làm việc On-site Required Mức độ kinh nghiệm Experienced Loại Giờ Làm Việc Toàn Thời Gian
Ứng tuyển

Job Description


DMTM self-sustaining (DSS) Collateral-Device Engineers are the pioneers responsible for enabling and sustaining Collateral functions (Design rules, Generator/DFM, Frame layout, Param design/etest, and TCAD) in HVM manufacturing independently. The Engineers are responsible to link fab process teams and design team seamlessly with highly effective business procedures established. The Engineers need to handshake with design team on design update, and work closely with collateral litho team on mask layer generation, DFM, frame layout edits, and reticle tape out based on process needs. The Engineers are also expected to work closely with fab teams (PI/PO/YE etc) to improve Yield/Reliability/ DPM, address excursions, and lead/support TF/WGs. The engineers are also expected to lead scientific research enabling manufacture of innovative device architectures coupled with the Designing, executing and analyzing experiments necessary to meet engineering specifications.

The position is associated with the sale of the NAND business to SK Hynix aligning to Phase 2 of the transaction. Employees aligned to Phase 2 will continue to be employed by Intel developing NAND technology and components. Phase 2 of the transaction is expected to close in March 2025 at which time employees aligned to this phase of the transaction will transition employment to Solidigm, a stand-alone US subsidiary of SK Hynix headquartered in San Jose, California with offices world-wide. Solidigm is a leading global supplier of NAND flash memory solutions, led by Robert (Rob) B. Crooke as CEO, previously senior vice president and general manager of Intel's Non-Volatile Memory Solutions Group


Qualifications


Minimum Qualifications:

Candidate must possess a PhD or Masters degree with experience in a relevant field such as Electrical Engineering, Materials Science and Engineering, Chemical Engineering, Physics or other similar technical degree.

Preferred Qualifications: Experience in the following: Logic process integration or device engineering Param analysis, report, NAND process integration engineering. Familiar with process characterization, qualification, troubleshooting and probe yield improvement Familiar with characterization techniques such as SEM, TEM, EDX, SIMS etc. Statistical design of experiments, SPC, PCS methodology, data analysis skills and experience with JMP, SQL PF, Python, Catalyst etc. In-depth knowledge of device physics, parametric test structures, and probe sort data. Familiar with CAD tools and software for test structure layout review Hands-on experiences in technology development, technology transfer and/or technology startup. Strong commitment in work and flexible in working time


Inside this Business Group


Employees in Intel's NAND Product Group deliver solutions that are transforming computing across all segments from data centers to Ultrabooks. They invent, develop, bring to market and support customers with leading-edge NAND flash memory and system level solutions such as solid state drives (SSDs). SSDs are accelerating performance for gaming enthusiasts, reducing total cost of ownership for IT managers of data centers and improving security and reliability for businesses. This dynamic group is strategically positioned to become the leading Non-Volatile Memory solution supplier for the compute segment and is a key to expanding markets and continuing the growth for Intel.


Posting Statement


All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits


We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.


Working Model


This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.
Ứng tuyển
Maggie, Offensive Security Researcher

Maggie Offensive Security Researcher

Tôi luôn muốn đóng góp được điều gì đó giúp thay đổi thế giới. Tại Intel, tôi cảm thấy mình được đánh giá cao và tự tin hơn vào bản thân. Điều đó khiến tôi nghĩ rằng mình có khả năng làm được những điều tuyệt vời.
Xem toàn bộ công việc

Bạn chưa có Công việc được xem gần đây.

Xem toàn bộ công việc

Bạn chưa có công việc đã lưu.

Xem toàn bộ công việc

Tham gia vào cộng đồng nhân tài của Intel

Hãy là người đầu tiên cập nhật mọi tin tức từ Intel! Đăng ký để nhận những tin tức và thông báo mới nhất.

Mở Form>