PGDM Module Engineer

Job Description

Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors.

The Disaggregated Manufacturing Organization (DMO) will play an important role in this strategy, leveraging Intel's Advanced Packaging technology portfolio to deliver leadership products. To enable this ramp, DMO is building an Advanced Packaging manufacturing facility in Malaysia, increasing its investment in this region which has been a critical part of Intel's supply chain for nearly five decades.

Join the Intel Malaysia Advanced Packaging team where you will be instrumental in developing and ramping some of Intel's newest Advanced Packaging technologies and help us realize Intel's vision to create and extend computing technology to connect and enrich the lives of every person on Earth.

Responsibilities will include, but are not limited to:
? Be part of the pioneer team in leading ramping Intel's latest Advanced Packaging technologies from process start-up to high volume manufacturing.
? Partnering with the production team to deliver world-class performance on critical success indicators (Safety, Quality, Output and Equipment performance) in a highly automated production facility.
? Provide sustainable training and coaching and leading 24/7 manufacturing technician team to troubleshoot and resolve equipment and process issues.
? Developing solutions to problems utilizing statistical knowledge and problem-solving tools to achieve best in class process stability.
? Interacting with partner factories worldwide to transfer new equipment/processes, maintain CE (copy exactly) parameters, best known method learnings and drive strategic improvement projects.

Qualifications

? BS/MS in Chemical/Mechanical/Mechatronic/Electrical Engineering or equivalent, with industry experiences in semiconductor field.
? Minimum 5 to 10 years' experience in Thin Film PVD/CVD equipment/ Planar / Plating/ Vacuum System and process engineering.
? Excellent communication skills with a high tolerance for ambiguous and dynamic situations.
? Demonstrated learning mindset on new equipment and process competency building.
? Ability to work fast and agile in a matrixed environment and build cohesive teams.
? Proven track record in technical problem solving and able to provide solution to overcome complex technical challenges.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.

Working Model

This role will require an on-site presence.