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Package Module Development Engineer

Kulim, Kedah, Malaysia Anzeigen-ID JR0263119 Stellenkategorie Manufacturing and Process Development Arbeitsmodus On-site Required Arbeitszeitmodell Vollzeit
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Job Description


  • Define and establish process flow, procedures, and equipment configuration for NPI products.
  • Selects and develops material and equipment for the process to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
  • Plans and conducts experiment to fully characterize the process throughout the development cycle.
  • Drives improvements on quality, reliability, cost, yield, process stability/proficiency, productivity and safety/ergonomic over variables such as material, method, equipment, environment and operating personnel.
  • Develops solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools.
  • Establishes process control systems for the process module and sustains the module through volume ramp.
  • Develops strategy to resolve difficult problems and establishes systems to deal with these problems in the future.
  • Trains production/receiving process engineers for transfer to other virtual factories.
  • Transfers process to high volume manufacturing and provide support in new factory start-up as well as install and qualification of the new production lines.

Qualifications


Minimum Qualifications:

  • Bachelor, Master, or PhD degree in a relevant science, engineering, and technology fields (Physics, Mechanical, Chemical, E&E and Materials Engineering related field). Fresh graduates are encouraged to apply.
  • Active participation in R&D focused on assembly and packaging processes.
  • Strong technical and analytical skills, with knowledge of statistical design of experiments and problem-solving techniques

Preferred Qualifications:

  • Experience in process and equipment engineering in semiconductor.
  • Proficiency in at least one of the following areas: Die Attach, Epoxy Underfill, Component Attach, Solder Ball Attach, Lid Attach, Laser Marking, Material Handling, Vision system.

A successful candidate should also exhibit the following behavioral traits: Problem-solving, analytical, troubleshooting willingness and communication skills.


Inside this Business Group


As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.


Posting Statement


All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits


We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.


Working Model


This role will require an on-site presence.
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Maggie, Offensive Security Researcher

Maggie Offensive Security Researcher

Ich wollte schon immer etwas tun, das die Welt verändert – bei Intel fühle ich mich geschätzt und ich habe mehr Selbstvertrauen gewonnen. Die Arbeit gibt mir das Gefühl, dass ich in der Lage bin, Großes zu leisten.
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