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FSM Global Yield FEOL (Front-End-Of-Line) Process Integration Development Engineer

Hsinchu, Taiwan, Taiwan Anzeigen-ID JR0265551 Stellenkategorie Manufacturing and Process Development Arbeitsmodus Hybrid Arbeitszeitmodell Vollzeit
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Job Description


Fab Sort Manufacturing (FSM) is responsible for the production of all Intel silicon using some of the world's most advanced manufacturing processes in fabs in Arizona, Ireland, Israel, Oregon and 2 new greenfield sites in Ohio and Germany. As part of Intel's Integrated Device Manufacturer 2.0 (IDM2.0) strategy, FSM is rapidly expanding its operation to deliver output for both internal and foundry customers with state-of-the-art technologies arriving in High-Volume Manufacturing (HVM) at a 2-year cadence going forward. Intel recently created HVM Global Yield organization in FSM to strengthen its yield operation and enable fast-paced yield ramp-up in early HVM phases for each technology in collaboration with Technology Development team and FSM fab managers.

This job requisition is to seek Sr. FEOL (Front-End-Of-Line) Process Integration Development Engineers for our FSM HVM Global Yield organization, reporting to FEOL Process Integration Engineering Development Manager. Selected candidates will work with other members in FEOL integration, other teams in Global Yield org, fab module, yield, and TD team members to achieve yield ramp-up and process optimization in early production stage, supporting internal and external customers.

Sr. FEOL Integration Development Engineer's responsibilities include (but not limited to):

  • Own engineering projects to execute HVM yield roadmap, device targeting and attain performance targets.
  • Collaborate with Technology Development and Local Yield teams to import new technology to production fabs.
  • Work with FEOL/BEOL Integration, Device, Defect Reduction and Yield Analysis team members to identify root cause of yield/performance issues and implement mitigation plan in defined timeline to meet committed production yield/performance targets and to support fast paced yield ramp-up in high-volume manufacturing phases.
  • Perform feasibility studies, plan and conduct experiments to fully characterize the process throughout the development cycle and to improve performance for each specific product.
  • Own NPI (New Product Introduction) in production fabs and perform product-specific process optimizations to meet foundry customers specifications and requirements.
  • Own engineering projects in partnership with Local Yield teams to improve product yield, quality, device performance and to reduce wafer cost.
  • Engineering support for technical interactions with internal and external customers.

#foundry

Important:  Please be informed that Intel is proactively trying to find candidates for a foundry engineering position which is frequently available at Intel US.  Please note that the position may not be available at this time.  If you would be interested in this position should it become available, we would encourage you to apply, and our hiring team will be glad to contact you when/if relevant. 


Qualifications


Minimum Qualifications:

  • Bachelor's Degree in Electrical Engineering, Physics, Chemistry, Materials Science or in a STEM related Field
  • 9+ years of experience in advanced node semiconductor industry in FEOL Process Integration in one (or more) of the following segments: Fin, Gate or PC, Spacer/Source-Drain or Junctions, RMG (Replacement Metal Gate), or Contact / MOL (Middle of the Line).
  • Experience on Device Physics and in advanced nodes FinFET technology, GAA (Gate-All-Around) in development or high-volume manufacturing.
  • Experience with processes including lithography, dry etch, wet etch, CMP, diffusion, implant, thin films and metrology.


Preferred Qualifications:

  • Advanced degree (Master's or Ph.D.) in Electrical Engineering, Physics, Chemistry, Materials Science or in a STEM related Field.
  • Experience in project/program management and/or Task Force Team lead.
  • Experience at leveraging big data analysis to identify process design weaknesses and/or manufacturing weaknesses in order to propose corrective, data-based solutions.
  • Experience in extracting insights from structured and unstructured data by quickly synthesizing large volumes of data and applying statistics and machine learning.
  • Experience in new semiconductor technology development.
  • Experience in Statistics and Machine Learning.


Posting Statement


All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits


We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.


Working Model


This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.
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Maggie, Offensive Security Researcher

Maggie Offensive Security Researcher

Ich wollte schon immer etwas tun, das die Welt verändert – bei Intel fühle ich mich geschätzt und ich habe mehr Selbstvertrauen gewonnen. Die Arbeit gibt mir das Gefühl, dass ich in der Lage bin, Großes zu leisten.
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