Module Development Engineering Manager

Hillsboro, Oregon, USA Anzeigen-ID JR0261677 Stellenkategorie Manufacturing and Process Development Arbeitsmodus On-site Required Erfahrungsstufe Experienced

Bewerben

Job Description

Are you interested in being part of Intel's strategy to advance Moore's law for the next 50 years? Are you passionate about your personal growth and Intel's culture initiatives? Then WATD is the place for you. As the needs for the worlds compute capabilities have evolved and grown, advanced packaging has become a critical part of the semiconductor industry roadmap. Wafer Assembly Technology Development (WATD), a part of Oregon Assembly Technology Development Factory (OATDF) and Assembly and Test Technology Development (ATTD), is at the center of Intel's advanced packaging technology development.

As a TD Module Development Engineering Manager, responsibilities include but not limited to:

Leads a team of module development engineers to drive technology development and enablement, provide integrated process solutions, and perform feasibility studies to meet desired device specifications while maximizing safety, quality, and process capabilities of wafer processing, assembly/test, and module repair factories.
Ensures execution of module improvement responsibilities such as equipment ownership and oversees process and equipment in a manufacturing line.
Leads growth of manufacturing capacity to high volumes to demonstrate the technology capability while simultaneously transferring the technology to manufacturing sites across the globe.
Drives cross organizational alignment towards process pathway solutions.
Deeply partners with integration, device, and yield engineering teams to build robust process solutions that will help deliver to power performance and area leadership with technology structural cost in mind.
Partners with supplier executive management to identify, nurture, develop, and implement unique research/industry ideas to life.
Coaches and leads engineering teams to reverse engineer and/or develop repair and improvement opportunities to improve cost, output, and yield.
Hires, manages, and coaches engineers in pathfinding and technology road mapping for advanced and future technology development, building a holistic view for subject matter expertise.
Develops long term strategies for module engineering capabilities to support future requirements.
Responsible for enabling teams to execute through clear goal setting, facilitating work, maintaining accountability, applying differentiated performance management, and driving team results.
Drives results by inspiring people, role modeling Intel values, developing the capabilities of others, and ensuring a productive work environment.

Qualifications

For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information.

You must possess the below requirements to be initially considered for this position.

Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Knowledge and/or experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Qualifications:

Bachelor's degree with 6+ years' experience or Master's degree with 4+ years' experience in Mechanical engineering, Electrical engineering, materials science, physics or related field.

Preferred Qualifications:

Bachelor's degree with 9+ years' experience or Master's degree with 6+years' experience in Mechanical engineering, Electrical engineering, materials science, physics or related field.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.

Working Model

This role will require an on-site presence.

Bewerben

Maggie Offensive Security Researcher
Ich wollte schon immer etwas tun, das die Welt verändert – bei Intel fühle ich mich geschätzt und ich habe mehr Selbstvertrauen gewonnen. Die Arbeit gibt mir das Gefühl, dass ich in der Lage bin, Großes zu leisten.

LTD TCAD Tech Intern Graduate PhD Mehrere Standorte Jetzt bewerben
Off Site Manufacturing (OSM) Technical Coordinator Intern Mehrere Standorte Jetzt bewerben
Corporate Security (Physical) Systems Specialist Hillsboro, Oregon Jetzt bewerben