FSM Global Yield - Thin Film Metro Engineer

Kiryat Gat, Southern District, Izrael Identyfikator oferty JR0263433 Kategoria Manufacturing and Process Development Tryb pracy Hybrydowy Poziom doświadczenia Doświadczony Wymiar etatu Praca na pełny etat

Aplikuj

Job Description

Fab Sort Manufacturing (FSM) is responsible for the production of all Intel silicon using some of the world's most advanced manufacturing processes in fabs in Arizona, Ireland, Israel, Oregon and 2 new greenfield sites in Ohio and Germany.

As part of Intel's IDM2.0 strategy, FSM is rapidly expanding its operation to deliver output for both internal and foundry customers with state-of-the-art technologies arriving in High-Volume Manufacturing (HVM) at a 2-year cadence going forward.

Intel recently created HVM Global Yield organization in FSM to strengthen its yield operation and enable fast-paced yield ramp-up in early HVM phases for each technology in collaboration with Technology Development team and FSM fab managers.

This job is to seek for Thin Film Metro Development engineering roles in FSM HVM Global Yield organization.

Selected candidates will :

Work with other members in metro team, other teams in Global Yield org, fab module, yield, integration, and TD team members to achieve yield ramp-up and yield improving in early production stage, supporting internal and external customers.
Collaborate with Technology Development team and Process Integration team to import and setup new technology to production fabs across the globe.
Identify critical yield limiting parametric steps to set production line monitoring strategy to increase yield and quality with maximum productivity and lowest cost.

Candidate should possess the following behavioral skills:

Problem-solving and project/program management experience with strong self-initiative and self-learning capabilities.
Demonstrated interpersonal skills to perform at leadership role including influencing, engaging, and motivating.
Proven track record of working across organization through matrix structures to accomplish strategic objectives with conflicting priorities.
Must demonstrate strong communication skills.

#FSM_DEFECT_IL

Qualifications

Minimum Qualifications:

Bachelor's degree in science and engineering major, with at least 5 - 8 years of experience.
Strong understanding on Thin Film Metro and yield impact in semiconductor high-volume production and proven quantified track record of yield improvement.
8+ years of experience in advanced node semiconductor industry in Thin Film metro or process engineering.
Basic understanding and collaboration experience with processes including lithography, dry etch, wet etch, CMP, diffusion, implant, thin films and metrology.

In addition :

Experience in Statistics and Machine Learning
Experience in working with Process Integration, Design and OPC teams to identify layout-sensitive defect weak points and address systematic defect issues
Knowledge of module tool impacts to defects, inline parametric and yield through PM life while understanding upstream and downstream impacts to other tools
Working knowledge in module processes including lithography, dry etch, wet etch, CMP, diffusion, implant, thin films, and metrology.
Skills to develop improvement projects at module level to improve process for reduced defectivity and improved yield.

Preferred Qualifications:

Experience in FinFET technology development or high-volume manufacturing with hands-on knowledge of FinFET technology process flow to analyze systematic defect sources and set mitigation actions.
Strong data analysis and programming skills - AI/Machine learning, Programming (SQL/Python/MATLAB), Software Development, Data Visualization.
Set up and optimize wafer inspection steps and recipes, to ensure detection of yield detracting defects in line at step.
Experience in Image process and big data analysis.

#Foundry

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.

Working Model

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.

Aplikuj

Maggie Offensive Security Researcher
Zawsze chciałam robić coś, co będzie zmieniać świat — w firmie Intel czuję się doceniona i nabrałam większej pewności siebie. Czuję, że jestem w stanie robić wspaniałe rzeczy.