New Mexico DMO Foundry Device Engineer

Job Description

Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors. Fab11X in New Mexico (NM) Disaggregation Manufacturing Organization (DMO) will play an important role in this strategy, where we are bringing up leading edge mixed signal, low voltage Bipolar - CMOS - DMOS Technology fit for a wide variety of products such as PMIC, battery management, analog and digital controllers and more.

This is an Individual Contributor role for Device Engineering in DMO NM Foundry Engineering.

As a Device Engineer, your responsibilities will include the following:

• Use Statistics, Data Mining, and other data analysis techniques to collect, explore, and extract insights from Electrical-test, yield, and fab data for new process qualifications and integrated issues.

• Set device, interconnect, and circuit performance targets for Process Design Kit releases and Interface with Design and Foundry partners to address circuit-level issues.

• Assess Silicon-to-Simulation health and readiness for High Volume Manufacturing.

• Help your team to define robust test structures and test programs to validate advanced design rules and reliably extract key device and interconnect parameters.

• Collaborating with customers to meet product requests, develop design rules, and manage interactions while ensuring manufacturability and reliability goals can be met.

• Planning and conducting experiments and data analysis to optimize and characterize new processes and understand sources of variation within the fab to improve process stability/capability.

• Developing solutions to problems utilizing formal education, statistical knowledge, experiment design, industry literature, and problem-solving tools.

The ideal candidate should exhibit the following behavioral traits:

• Excellent communication skills and demonstrated ability to work across organizational boundaries to meet objectives and key results while fostering a challenging and positive work environment.

• Expertise in dealing with both internal and external customers.

• Demonstrated track record of leading device, process integration, and module engineering co-development.

• High tolerance of ambiguity, demonstrated flexibility and adaptability in a fast-changing environment.

• Established track record of problem-solving with creativity and out-of-box thinking as well as future, strategic, and possibility thinking.

• Proven technical leadership skills with the ability to directly influence a diverse team of engineers.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

Candidate must possess at least one of the following 3 degrees; plus, the years of experience required for each degree in the areas specified below:

• Bachelor's degree in an Engineering or Physics, Electrical Engineering, Chemistry, Material Science, or a related field of study with 6+ years of experience.

• Master's degree in an Engineering or Physics, Electrical Engineering, Chemistry, Material Science, or a related field of study with 4+ years of experience.

• PhD degree in an Engineering or Physics, Electrical Engineering, Chemistry, Material Science, or a related field of study with 2+ years of experience.

• Experience on Semiconductor materials, fabrication, electrical characterization, and device physics.

• Experience on Statistical Process Control (SPC) or Design of Experiments (DOE) principles and engineering analysis tools.

• Experience on Analytical Techniques applied to CMOS device engineering.

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Preferred Qualifications:

• Advanced transistor device structures and Device Physics.

• Fundamental understanding of semiconductor processing and device fabrication.

• Process monitoring test structures design and layout experience.

• Electrical characterization of transistor devices.

• Device and circuit simulation.

• Familiar with electrical bench characterization.

• Expertise in database structures, research methods, machine learning, analytics packages (i.e., JMP, MATLAB, Octave), scripting languages (i.e., Python, JSL, Perl, TCL), or programming languages (i.e., SQL, C/C++).

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.

Working Model

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.