The successful candidate will join Intel Network Products Operation (NPO) within the Connectivity Group and lead the board hardware development and validation of optical and copper Network Interface board products. These products, and the support Intel provides, generate profits and are key to the success of current and next generation Intel platforms for major OEMs and Cloud customers.
-At least a Bachelors degree in Electrical & Electronic Engineering (or equivalent)
-3+ years of experience designing, debugging and bringing to production circuit boards containing PCI express and high-speed Ethernet interfaces - 1/10/25/40/100G+
-Experience designing board products with PCIe gen3+
-Experience with DFM/DFTespecially Intel's version, US and international regulatory requirements.
-Experience designing Ethernet physical layer interfaces to be specification regulatory compliant- fiber, copper and backplane
-Experience working with Cadence Allegro-Ability to create clear complete documentation board hardware specifications, test methodology, test plans, test reports
-Ability to work and contribute in a cross-functional product team - marketing, manufacturing, customer support, test, etc - identifies deliverables, represent HW schedule and communicate regular status.
-Experience debugging at the circuit board level using scopes, logic analyzers, and other relevant lab equipment
The Data Center Group (DCG) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.