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Job ID: JR0039289
Job Category: Engineering
Primary Location: Boise, ID US
Other Locations:
Job Type: Experienced Hire

Sr. Process Development Engineer

Job Description

*THIS POSITION IS LOCATED IN LEHI UTAH.

Intel's Memory Technology Development group is looking for experienced Sr. Process Development Engineers in process areas such as Dry Etch, Thin Films CVD, PVD, CMP, Wet Cleans, Thin Films Metrology, Lithography, and Diffusion to help develop world class HVM processes. The ideal successful candidate will strive to achieve and deliver leading edge process capability, yield, cost and manufacturability. This will involve exceptional collaboration with cross-functional/cross-company teams and tool vendors to meet challenging program goals. The successful candidates must have a proven track record of delivering leadership results in leading edge silicon process development.

The candidate must have an MS/PhD in related field and at least 5 years of experience in semiconductor technology. Defines roadmaps to meet requirements, goals and milestones for a new technology process. Defines and establishes flow, procedures, and equipment configuration for the module. Selects and develops material and equipment for the process to meet quality, reliability, cost, yield, productivity and manufacturability requirements. Plans and conducts experiments to fully characterize the process throughout the development cycle. Drives improvements on quality, reliability, cost, yield, process stability/capability, productivity and safety/ergonomic over variables such as material, method, equipment, environment and operating personnel. Develops solutions to problems utilizing formal education, statistical knowledge, and problemsolving tools. Establishes process control systems for the process module and sustains the module through volume ramp. Develops strategy to resolve difficult problems and establishes systems to deal with these problems in the future. Trains production/receiving process engineers for transfer to other factories. Transfers process to high volume manufacturing and provide support in new factory startup as well as install and qualification of the new production lines.


Qualifications

*THIS POSITION IS LOCATED IN LEHI UTAH.

Education:

PhD degree Or Masters with over 10 years of experience in Electrical Engineering, Chemical Engineering, Material Science, Physics or Chemistry with over 5 years of experience in the semiconductor industry.

Minimum Requirements:   

  • Minimum 5 years of hands on experience in semiconductor FAB processing
  • Minimum 5 years of experience in Statistical Process Control SPC or Design of Experiments DOE principles
  • Minimum 5 years of experience in semiconductor process equipment maintenance

Additional Requirments:

  • Demonstrate experience with technical problem solving skills with multitasking
  • A fast learner to adapt to the culture and the technology
  • Demonstration experience to work with external and internal partner
  • Must be flexible in accommodating changing priorities and working hours to support business needs

Inside this Business Group

Non-Volatile Solutions Memory Group:  The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices.  The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.


Posting Statement. Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.
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