PGDM Undergraduate Technical Intern

Job Description

Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors. The Disaggregated Manufacturing Organization (DMO) will play an important role in this strategy, leveraging Intel's Advanced Packaging technology portfolio to deliver leadership products. To enable this ramp, DMO is building an Advanced Packaging manufacturing facility in Malaysia, increasing its investment in this region which has been a critical part of Intel's supply chain for nearly five decades. Join the Intel Malaysia Advanced Packaging team where you will be instrumental in developing and ramping some of Intel's newest Advanced Packaging technologies and help us realize Intel's vision to create and extend computing technology to connect and enrich the lives of every person on Earth. In this position you will be supporting organization operations to establish effective maintenance program toward best in class in safety, cost effective, interrupt free and conformant to ISO standard. Responsibilities will be included but not limited to: � 2-3 month internship supporting multiple manufacturing organizations. � Data analysis and report generation; ensuring systems operate reliably to avoid manufacturing/facility (or operations) impacts by meeting uptime goals. � Identify and implement opportunities to achieve lowest cost of ownership to key stakeholders while maintaining reliability. The successful candidate should exhibit the following behavioral traits: � Customer Orientation. � Communication skills. � Develop creative approaches/solutions. � Self-starter and team player. � Organization and prioritization skills.

Qualifications

The candidate must be Malaysia Citizen and undergoing one of the following educational requirements: Degree in Chemical/Mechanical/Mechatronic/Materials/ Electrical Engineering, Computer Science, Data Science, IT or equivalent. CGPA Min 3.0 Preferred Qualifications: � Effective programing and data fluency skills with a high tolerance for ambiguous and dynamic situations. � Demonstrated learning mindset on new equipment and systems. � Ability to work fast and agile in a matrixed environment.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.

Working Model

This role will require an on-site presence.