Fab11x EMIB/FOVEROS Technology Development Device Engineer

Job Description

Intel's Advanced Packaging (AP) technologies extend and drive Moore's Law as the company aspires to a trillion transistors in a package by 2030. Intel has led the industry in disaggregated advanced packaging for a couple of decades. Its innovations include EMIB (embedded multi-die interconnect bridge) and Foveros, technologies that allow multiple chips on a package to be connected side by side (EMIB) or stacked on top of one another in a 3D fashion (Foveros).

The Disaggregated Manufacturing Organization (DMO) develops fab processes for Foveros base silicon interposer and embedded multi-die interconnect silicon bride (EMIB) architectures to enable both internal and Foundry AP future roadmaps.

The New Mexico DMO Technology Development Team is looking for a Device engineer to join our EMIB/FOVEROS TD team.

Responsibilities include the following but are not limited to:

• Extracting, analyzing, and summarizing e-test data.

• Owning determining the actions required by the factory to deliver Best in Class device performance.

• Ensuring changes to process targets are neutral or beneficial to yields. Partnering with the Technology Development team to develop and qualify process improvements and design creative solutions to detect inline marginalities using e-test and scribe structures.

• Preparing detailed, clear, and timely reports summarizing the device health for products.

• Lead/Participate in Continuous Improvement activities that range from etest, yield enhancement, cost reduction, and productivity / output improvement.

• Developing strong partnerships with diverse groups such as Process Engineering, Integration, Quality and Reliability (QNR), and Product Development Engineering.

• Developing solutions to problems using process knowledge, statistical knowledge, and problem-solving skills.

The ideal candidate should exhibit the following behavioral traits:

• Excellent analytical skills and a passion for data analysis and problem solving. Established track record of problem-solving with creativity and out-of-box thinking as well as future, strategic, and possibility thinking.

• Demonstrated willingness to work across organizational boundaries to meet objectives and key results while fostering a challenging and positive work environment.

• Communication and presentation skills to influence and direct a wide variety of groups at all levels.

• High tolerance of ambiguity demonstrated flexibility and adaptability in a fast-changing environment.

• Strong organizational skills with a focus on attention to detail.

Full time onsite required during training, estimated 6 months.
After training: hybrid “work from home” to be defined by manager and employee but continued onsite will be required. 

Relocation assistance provided.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:
Candidate must have a bachelor's or a Master's degree in Electrical Engineering, Material Science, Microelectronics Engineering, Physics or related field.

• 3+ years of experience on strong technical depth and demonstrated fab interconnect expertise.

• 4+ years of experience on device experience.

Preferred Qualifications:

• Master's or Ph.D. degree in Electrical Engineering, Computer Science, or Device Physics

• Demonstrated track record of Process Development or Process Development in foundry environment.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.

Working Model

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.