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PGDM Planar (CMP) Module Engineer

Pulau Pinang, Malaysia ID Pekerjaan JR0261727 Kategori Kerja Manufacturing and Process Development Mod Kerja On-site Required Tahap Pengalaman Experienced
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Job Description


Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors. The Disaggregated Manufacturing Organization (DMO) will play an important role in this strategy, leveraging Intel's Advanced Packaging technology portfolio to deliver leadership products. To enable this ramp, DMO is building an Advanced Packaging manufacturing facility in Malaysia, increasing its investment in this region which has been a critical part of Intel's supply chain for nearly five decades. Join the Intel Malaysia Advanced Packaging team where you will be instrumental in developing and ramping some of Intel's newest Advanced Packaging technologies and help us realize Intel's vision to create and extend computing technology to connect and enrich the lives of every person on Earth. As a Planar Module Engineer, you will report to the corresponding functional Department Manager, your responsibilities will include, but are not limited to: 1. Lead as the functional area engineering expert on equipment design, install, qualification, ramp and sustaining for the Passive Interposer, in partnership with the home team, transfer sites and support groups. 2. Be the champion to ensure the functional area is performing to factory expectation in safety, quality (yield, matching), output, cost indicators, working alongside 24/7 technician team and suppliers to root cause fix equipment issues, promptly contain and resolve excursions, and standardize procedures. 3. Lead as the functional area Equipment engineering expert, mentor and guide ACs, Home team Engr and Technician for all tools installations, ensure smooth and successfully startup per project milestone to ensure long-term success. 4. As Module Engineer/ Individual Contributor, help setting priorities for the team, get results across boundaries, ensure an inclusive work environment, train employees, owning safety within area of influence; ensuring systems operate reliably to avoid manufacturing/facility (or operations) impacts by meeting uptime goals. 5. Act as Equipment expert (Equivalent ramp specialist) to make Planar (CMP) Module successfully startup from facility hookup till complete tool install and qualification for production. Experience with AMAT and Ebara CMP platforms would be beneficial. 6. As FMEA lead, Equipment Technical Trainer/ Advisor and train up Engineer and Technician equipment competency 7. As E3 /FDC super user setup and optimize equipment output critical parameters co-relation to specification requirement/product issues are analyzed and acted upon 8. Setup spare part inventory and system. Explore Repair opportunity (where) and logistics (how). Explore 3rd party consignment activities for non OEM parts and inventory cost, work on setting up dashboards to compare the tool performance, lead critical/complex task force teams to address site wide issues. The ideal candidate should exhibit the following behavioural traits: 1. Must be a self-starter, highly organized, and have an ability to work independently across organizations. 2. Demonstrated skills to synthesize complex problems into clear messages and proposals through presentations, as well as communicating throughout the organization and factory. 3. Skills to lead problem-solving efforts and exerting influence with other organizations and management. 4. Interpersonal and relationship building skills with peers, stakeholders, and customers. 5. Places high priority on the safety of themselves and those around them. 7. Has a proven track record as a strong leader with high technical and analytical skills. 8. Prepared to make informed technical decisions and providing direction 9. Support and manage startup program regarding sourcing, installation, and factory acceptance of new equipment, include equipment maintenance and parts clean/replacement; Identifies, procures, implements, and qualifies new equipment and existing re-used equipment add-on capabilities. 10. Troubleshoots, determines root-cause, and addresses equipment issues; prepares lessons learned documentation for all failures requiring multistep troubleshooting 11. Proven track record in tool installation of AMAT/Ebara CMP tools. Oversee the installation, modification, upgrade, and maintenance of equipment as well as provide coaching to Module engineer/Technician. Direct equipment expertise in chemical and slurry delivery systems is a plus. 12. Excellent communication skills with a high tolerance for ambiguous and dynamic situations.

Qualifications


Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. 1. BS in Chemical/Mechanical/Mechatronic/Electrical Engineering or equivalent, with 6+ industry experiences in semiconductor field. 2. MS in Chemical/Mechanical/Mechatronic/Electrical Engineering or equivalent, with 4+ industry experiences in semiconductor field. 3. Phd in Chemical/Mechanical/Mechatronic/Electrical Engineering or equivalent, with 2+ industry experiences in semiconductor field. Direct industry experience in Semiconductor Wafer Fabrication in CMP equipment in Maintenance and/or Process Preferred Qualifications 1. 10+ years CMP process and equipment expertise including process development, slurry selection and process and equipment upgrades installation and qualification 2. Experience in using MES systems 3. 5+ years Statistical Process Control experience 4. Demonstrated competency in semiconductor tool installation, factory acceptance and qualification capabilities 5. Ability to work fast with agility in a matrixed environment 6. Proven track record in technical problem solving and ability to provide solution to overcome complex technical challenges.

Inside this Business Group


As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.


Posting Statement


All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits


We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.


Working Model


This role will require an on-site presence.
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