PGDM Die Aggregation Engineering Intern

Job Description

Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors. The Disaggregated Manufacturing Organization (DMO) will play an important role in this strategy, leveraging Intel's Advanced Packaging technology portfolio to deliver leadership products. To enable this ramp, DMO is building an Advanced Packaging manufacturing facility in Malaysia, increasing its investment in this region which has been a critical part of Intel's supply chain for over five decades. Join the Intel Malaysia Advanced Packaging team where you will be instrumental in developing and ramping some of Intel's newest Advanced Packaging technologies and help us realize Intel's vision to create and extend computing technology to connect and enrich the lives of every person on Earth. In this role, you will support module operations to establish and maintain a startup and sustaining program that is best in class for safety, cost-effectiveness, uninterrupted operation, and compliance with Intel standards. Responsibilities will include, but are not limited to: � Involved in supporting startup, install and qualify module tools or equipment to ensure meeting the highest safety and quality standards while maintaining cost efficiency. � Ability to analyze data using statistical tool or software. � Explore on opportunity to simplify on documentation, process to achieve efficiency for tracking or monitoring of data. � Willing to have some work hour flexibilities while performing install qual in the production environment. The successful candidate should exhibit the following behavioral traits: � Must role model safety as a value and adhere to stringent environmental compliance culture. � Strong in written and verbal communication in English language. � Excel as an individual contributor and part of a team. Proactive and work independently.

Qualifications

Qualification: � Pursuing Bachelor's Degree in Electrical and Electronics Engineering, Mechanical Engineering, Computer Engineering or any other Engineering or related field of study. � CGPA minimum 3.0. Preferred Qualifications: � Demonstrated learning mindset on new equipment and systems. � Ability to work fast and agile in a matrixed environment. � Knowledge in data science, SQL, JMP, statistics, advanced Excel, Power BI, project management will be an added advantage. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/ classes/ research.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.

Working Model

This role will require an on-site presence.