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Wafer Assembly CMP Module Development Engineer

Hillsboro, Oregon, Amerika Syarikat ID Pekerjaan JR0261468 Kategori Kerja Manufacturing and Process Development Mod Kerja On-site Required Tahap Pengalaman Experienced Jenis Waktu Bekerja Sepenuh Masa
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Job Description


As wafer level assembly technology development (WATD) CMP Module Engineer, you are responsible for driving plating process technology development to enable best plating process to meet program needs. You will design, execute and analyze experiments to improve process efficiencies. You will engage closely with equipment suppliers to identify the hardware modification for better process outcome. You will develop new chemicals and processes to meet program needs. You will develop plating processes that sustainable for high manufacturing volumes, to demonstrate the technology meets requirements while simultaneously transferring the technology to counterparts in manufacturing via the Copy Exactly methodology. You will be responsible to install and qualify manufacturing capacity at the development site and audit installation/qualification and supervise first full loop at the production site. You will develop and sustain plating process in semiconductor fab manufacturing operations.

Qualifications


For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information.

You must possess the below requirements to be initially considered for this position.

Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Knowledge and/or experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Requirements:

  • PhD degree with 2+ years or Master degree with 4+ years of experience in Engineering, Materials science, Chemistry, Physics, or a closely related scientific STEM field.
  • 4+ years of direct plating or related module engineering process/hardware technology development experience.
  • CMP,any other FAB experience


Inside this Business Group


As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.


Posting Statement


All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits


We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.


Working Model


This role will require an on-site presence.
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