EMIB Technology Development Process Champion

Job Description

Intel's Advanced Packaging (AP) technologies extend and drive Moore's Law as the company aspires to a trillion transistors in a package by 2030. Intel has led the industry in disaggregated advanced packaging for a couple of decades. Its innovations include EMIB (embedded multi-die interconnect bridge) and Foveros, technologies that allow multiple chips on a package to be connected side by side (EMIB) or stacked on top of one another in a 3D fashion (Foveros).

The Disaggregated Manufacturing Organization (DMO) develops fab processes for Foveros base silicon interposer and embedded multi-die interconnect silicon bride (EMIB) architectures to enable both internal and Foundry AP future roadmaps.

The DMO EMIB/Silicon Interposer TD Process Champion will be the interface between the DMO TD Org and Process Module Teams in Fab/Assembly to meet TD Program Deliverables.

Responsibilities include the following:
- Collaborate across ATTD, LTD, ATTD, FEC, and IFS orgs to develop fab processes that efficiently meet overall AP Program needs through technology certifications.
- Drive fab process readiness (PRI) activities from concept through HVM ready milestones including alignment of technology-enabling equipment selections with target spec definition, technology cost roadmap development, and manufacturability.
- Understand interactions of fab processing (ex: warpage, scribe layout) with various developing assembly processes to enhance overall development cadence for future roadmap offerings.
- Coordinate resourcing across teams to ensure milestones are on track to meet the development timelines of several programs progressing in parallel.
- Develop roadmaps to meet new technology requirements across process modules.

The ideal candidate will exhibit the following behavioral traits:
- Clear communication across various organizations and levels.
- Demonstrated ability to drive cross-organizational teams to deliver program deliverables.
- Drive solutions to technology challenges as they arise while maintaining delivery of overall program deliverables.
- Creativity and flexibility to address the emerging challenges of AP through strong cross-team collaboration while maintaining data-driven and constructive work environments.
- Develop a growing pipeline of individuals, managers, and teams to continue to drive Intel's current and future AP roadmaps.

Qualifications

Minimum Qualifications
Masters in an Engineering or Physics/EE/Chemistry/Material Science related field.
15+ years direct experience in process development or integration of semiconductor devices

Preferred Qualifications:

PhD in an Engineering or Physics/EE/Chemistry/Material Science related field.

10+ years of experience in semiconductor process development as a process engineer, process integrator or technical program manager.
-Prior experience as a Process Champion or Program Manager
-Prior Assembly (wafer/package) process development and/or integration experience
-Prior Fab process development and/or integration experience

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.

Working Model

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.

Position of Trust
This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.