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Job ID: JR0049706
Job Category: Manufacturing
Primary Location: Santa Clara, CA US
Other Locations: PRC, Dalian;US, Arizona, Phoenix;US, California, Folsom;US, Oregon, Hillsboro;US, Utah, Lehi
Job Type: Experienced Hire

Module Engineering Manager - Expat Role to Dalian, China

Job Description

F68 Technology and Strategy Office TSO at Intel Dalian is forming a new engineering team with focus on manufacturing cost reduction through innovation, product enhancement, as well as developing and enabling equipment and process capabilities for future generations of 3D NAND technologies.

This job requisition is to seek for strong candidates for the positions of Module Engineering Manager, reporting to Process Solutions Area Manager in TSO.

The selected candidates will build and manage several strong teams of process and equipment engineers, and direct all process, hardware, materials, and operational activities within their areas, manage and coach engineers, and guide employee development, performance, and productivity issues.

This requisition has two openings.

Thin Film Module Engineering Manager will manage CVD/PVD/CMP/Diffusion/Implant/Metro areas, and Patterning Module Engineering Manager will manage Lithography/Wet Etch/Dry Etch areas.

*The position requires up to 2 years of expatriate assignment in Dalian, China.


Qualifications

Candidate must have demonstrated a track record of excellence in creative problem solving, equipment capability enabling, or manufacturing process optimization in a relevant engineering organization, and must have direct people management experiences. Technical Qualifications BS, MS, or PhD in a science or engineering field and minimum 5 years of experience in research, development or manufacturing environment for the relevant module areas are required Demonstrated technical leadership and a track record of problem solving with creativity and out-of-box thinking--Hands-on experiences in technology development, technology transfer or startup are required Strong expertise of process integration, device, and yield improvement is required Direct experience in Silicon Process Technology Development is highly desired. Other Qualifications Motivated self-starter, with strong ability to work independently as well as in a team environment Strong verbal and written communication skills in English Think and operate independently, while simultaneously focusing on many diverse priorities. Flexibility and maturity in facing uncertainties and changing priorities/responsibilities Commit to aggressive goals and win with a can-do attitude Act with velocity and a strong sense of urgency Respect cultural diversity and sensitivity Agility in learning, improving, and innovating.

Inside this Business Group

Non-Volatile Solutions Memory Group:  The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices.  The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.



Other Locations

PRC, Dalian;US, Arizona, Phoenix;US, California, Folsom;US, Oregon, Hillsboro;US, Utah, Lehi


Posting Statement. Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.

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