Seeking an intern for the Summer of 2018. This internship will be working in the Capillary Underfill Dispense Equipment Development module of Assembly Technology Group in TMG. Projects will be to focused on polymer material dispense fundamentals and improving the equipment and processes therein.
The ideal candidate should exhibit the following behavioral traits:
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth