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Job ID: JR0049082
Job Category: Intern/Student
Primary Location: Phoenix, AZ US
Other Locations:
Job Type: Intern

Summer 2018 Technical Internship

Job Description

Seeking an intern for the Summer of 2018. This internship will be working in the Capillary Underfill Dispense Equipment Development module of Assembly Technology Group in TMG. Projects will be to focused on polymer material dispense fundamentals and improving the equipment and processes therein.

The ideal candidate should exhibit the following behavioral traits:

  • Strong communication and presentation skills.
  • Strong project manager.Strong Interpersonal skills.


Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

Posting Statement. Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.
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