Responsible for the thermal/fluid/mechanical design, analysis, and development of electronic packages.
Conducts simulation and experiment to characterize the dynamic behavior of electronic packaging to improve assembly and reliability performance.
Conducts tests and research on basic materials and properties.
Provides limited consultation concerning packaging problems and improvements in the packaging process.
Responds to customer/client requests or events as they occur.
Develops solutions to problems utilizing formal education and judgment.
Master/PhD in Mechanical Engineering
Have some experience in Finite Element Modeling/Computational Fluid Dynamics
Have some experience in running mechanical and thermal related experiments
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth