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Job ID: JR0048707
Job Category: Engineering
Primary Location: Penang, PNG MY
Other Locations:
Job Type: College Grad

Failure Analysis Engineer

Job Description
In this position, you will be performing Failure Analysis and root cause analysis on Intel SoC, CPU, Chipsets and Netcomm platform products. This includes PC system and/or tester testing and analysis to isolate the failing instruction and internal signal, applying circuit analysis and various device localization equipment and techniques to localize the failing circuitries and performing physical failure analysis to locate the defect. Your responsibilities will include but not be limited to1. Responsible for improving product yield, quality and reliability through the recommendation of corrective actions to counterparts in Fab and Assembly and Test for root cause fix 2. Participating in new product and/or technology transfer and startup, enabling automation and improvement on the failure analysis process, tools and methodology, developing new FA techniques and proliferating learning across sites


Qualifications

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

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