3D XPoint Advanced Memory Technology Development Engineer
This is an exciting opportunity to work on the latest breakthrough in Non-Volatile Memory Technology: Intel® 3D XPoint™ memory and Intel® Optane™ Technology.
This role’s primary responsibilities include electrical characterization of 3D XPoint memory arrays, developing memory operation and testing algorithms, collaborating with design engineering, test engineering, product engineering, and process engineering in the development of Intel® 3D XPoint™ memory technology and delivery of the technology to high-volume manufacturing, as well as collaborating with reliability engineering and systems engineering for the qualification of Intel® Optane™ Technology products.
The right candidate will be highly confident in his/her expert knowledge of fundamental device physics, electrical circuits, mathematics and statistics, and will be familiar with memory architectures. The right candidate must also be passionate to be involved in the development of cutting-edge technology, and be excited to be engaged in a fast-paced working environment.
Behavioral Requirements: Ability to work independently and efficiently to address complex technical challenges, Excellent communication and presentation skills, and have a demonstrated track-record of working effectively in a cross-functional team setting.
Candidate should possess a BS or a MS degree with at least 3 years additional experience or a Doctor of Philosophy degree with at least 1 year additional experience, in Physics, Electrical Engineering, or a related field.
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.