The Quality and Reliability Development team in Intel Malaysia is looking for a motivated engineer to join the highly challenging environment of Intel future products reliability screening test capability development.
You will be developing burn in solution for product qualification and High Volume Manufacturing.
Work includes all aspects of stress capability development such as design for stress definition, pre/post si test pattern validation, BI hardware development, test program development, post-si debug, burn in enabling for qualification and for production with all success indicators met.
Inside this Business Group
The Platform Engineering Group (PEG) is responsible for the design, development, and production of system-on-a-chip (SoC) products that go into Intel’s next generation client and mobile platforms. PEG strives to lead the industry moving forward through product innovation and world class engineering.