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Job ID: JR0047422
Job Category: Intern/Student
Primary Location: Phoenix, AZ US
Other Locations:
Job Type: Intern

SPTD ME2 Intern

Job Description

Substrate Packaging Technology Development (SPTD) is looking to hire an engineer to join a team tasked with developing and ramping advanced organic substrate and packaging technologies via an internal pathfinding, technology development, and low volume manufacturing line. As a Packaging R&D Intern in Module Engineering, you will be required to develop material characterization and process technology in the SPTD Lithography Area. This is a 'hands-on' position will require a significant amount of time spent on the factory floor to develop new process technology and characterization of new materials. Since this will involve startup of new manufacturing capability for Intel, a high tolerance of ambiguity and flexibility with respect to job roles is desired.

 

The ideal candidate should exhibit the following:

  • Strong interest in hands-on work with process equipment.
  • Solid theoretical and practical understanding in materials characterization.
  • Excellent listening, written and verbal communication skills.
  • Demonstrated problem solving and analytical skills.
  • Demonstrated capability of working and excelling in a high performing team environment.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.


Minimum Qualifications:

  • Be currently pursuing a MS or PhD in Material Science and Engineering, Mechanical Engineering, Chemical Engineering, or any related science or engineering field.
  • Have hands-on experience in equipment development , expertise relevant to microfabrication and/or integrated circuit packaging, as well as hands-on experience in photolithography, materials characterization, lamination tools, and/or wet chemical processing.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth


Posting Statement. Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.
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