Apply Now    
Job ID: JR0036178
Job Category: Manufacturing
Primary Location: Dalian, Liaoning CN
Other Locations:
Job Type: Experienced Hire

Module Engineering Manager

Job Description

F68 Technology and Strategy Office TSO at Intel Dalian is forming a new engineering team with focus on manufacturing cost reduction through innovation, product enhancement, as well as developing and enabling equipment and process capabilities for future generations of 3D NAND technologies. This job requisition is to seek for strong candidates for the positions of Module Engineering Manager, reporting to Process Solutions Area Manager in TSO. The selected candidates will build and manage several strong teams of process and equipment engineers, and direct all process, hardware, materials, and operational activities within their areas, manage and coach engineers, and guide employee development, performance, and productivity issues.This requisition has two openings. Thin Film Module Engineering Manager will manage CVD/PVD/CMP/Diffusion/Implant/Metro areas, and Patterning Module Engineering Manager will manage Lithography/Wet Etch/Dry Etch areas.An expatriate assignment of up to 2 years might be required for qualified internal candidates.


Qualifications

Inside this Business Group

Non-Volatile Solutions Memory Group:  The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices.  The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

Apply Now    

What would you like to do now?

Connect with Us

Get Job Alerts

Get started
Student Center

Find out more about working at Intel

Learn more
Education

Jobs@Intel Blog

Learn more

Grow your network of opportunities