F68 Technology and Strategy Office TSO at Intel Dalian is forming a new engineering team with focus on manufacturing cost reduction through innovation, product enhancement, as well as developing and enabling equipment and process capabilities for future generations of 3D NAND technologies. This job requisition is to seek for strong candidates for the positions of Integration Engineering Manager or Device Engineering Manager, reporting to Integration Solutions Area Manager in TSO. The selected candidate will build and manage several strong teams, direct technology and resource planning activities, define and drive technology improvement and enablement roadmap, manage and coach engineers, and guide employee development, performance, and productivity issues.This requisition has two openings. Integration Engineering Manager will manage FEOL/BEOL Integration, YA, EFA, and Defect Reduction areas, while Device Engineering Manager will manage Device, Quality and Reliability, and inline and end of line test areas.An expatriate assignment of up to 2 years might be required for qualified internal candidates.
Inside this Business Group
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.