As part of Intel, we will continue to apply Moore's Law to drive the future of field-programmable gate array FPGA technology leveraging package technology. The Programmable Solutions Group PSG has been delivering industry-leading custom logic solutions to customers since inventing the world's first reprogrammable logic device in 1984.
In order to take advantage of the many opportunities that we see in the future for FPGA's, PSG is looking for great packaging engineers to join our team. We are seeking an expert knowledge of flip-chip, wire-bond, and multi-die package technologies and understanding of chip-package interactions CPI. This role will draw on your background in backend wafer processing bumping, scribe, etc., wafer level packaging, and 2.5D packaging.
The Programmable Solutions Group (PSG) was formed from the acquisition of Altera. As part of Intel, PSG will create market-leading programmable logic devices that deliver a wider range of capabilities than customers experience today. Combining Altera's industry-leading FPGA technology and customer support with Intel's world-class semiconductor manufacturing capabilities will enable customers to create the next generation of electronic systems with unmatched performance and power efficiency. PSG takes pride in creating an energetic and dynamic work environment that is driven by ingenuity and innovation. We believe the growth and success of our group is directly linked to the growth and satisfaction of our employees. That is why PSG is committed to a work environment that is flexible and collaborative, and allows our employees to reach their full potential.