In this position, you will be part of a TD and Manufacturing Lab responsible for performing failure analysis, material analysis and thermal mechanical characterization in support of silicon process technology development and high volume production HVM. Conducting hand-on lab analysis by effectively utilizing lab techniques and operating equipment, such as thin film stress measurement, 4point bending test, indentation and SEM imaging etc. Delivering quality results in a timely fashion to support HVM/TD customer needs Writing reports for routine analysis. Working with engineers and other technicians to coordinate the workload and ensure smooth operations Maintaining lab equipment. Executing and developing lab BKM methods.
The candidate should have the below behavioral traits:
This is an entry level position and will be compensated accordingly.
You must possess the below minimum qualifications to be initially considered for this position. Relevant experience can be obtained through school work, classes and project work, internships, military training, and/or work experience.
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth