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Job ID: JR0019373
Job Category: Engineering
Primary Location: Dalian, Liaoning CN
Other Locations:
Job Type: College Grad

Probe NAND Test Program Development Engineer

Job Description
This position is Intel 3D NAND product Wafer Level Test Program Development Engineer for a high volume manufacturing fab located in Dalian, China. Qualified candidate is responsible for developing and maintaining wafer level functional test strategies and programs, developing innovative solutions for production test flows, interface hardware, and test equipment. Your responsibilities also include performing redundancy analysis schemes, optimizing device yields, and partnering with stakeholders to optimize and automate equipment and processes.


Qualifications

Minimum Qualifications: - BS or MS degree in Electronic Engineering or Computer Engineering. - Intermediate C/C++ programming and Linux skills.- Proficiency in APG programming- Fluent in both English and Mandarin. - Demonstrate experience in semiconductor manufacturing and semiconductor testing. Preferred Qualifications: - More than 2 years' experience in NAND product test program development.- Intermediate understanding of NAND test equipment and interface hardware.- Intermediate Perl programming skills- Intermediate understanding of statistical principle and data analysis- Proven ability in multi-tasking complex projects- Excellent teamwork skills, ability to cooperate well with global stakeholders.

Inside this Business Group

Non-Volatile Solutions Memory Group:  The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices.  The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

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