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Process Integration Engineer

鳳凰城, 亞利桑那州, 美国| 希尔斯伯勒, 俄勒冈州, 美国 職位 ID JR0271018 職位類別 Manufacturing and Process Development 工作模式 Hybrid 經驗級別 Experienced 工时类型 全職
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Job Description

Join Intel and build a better tomorrow. Intel is in the midst of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of every person on Earth. So, join us and help us create the next generation of technologies that will shape the future for decades to come.

Foundry Manufacturing and Supply Chain (FMSC) organization is the high-volume manufacturing arm of Intel Foundry, providing geographically balanced, sustainable, secure, and resilient supply chain at scale. The development group within FMS delivers process customizations and the integrated solution to our systems foundry customers using the installed base of tools and capabilities at wafer and package level. FMSC Development group is seeking a highly skilled and experienced leader with broad experience in foundry technology development and customization. As a technology leader, you will be responsible for developing and customizing existing technologies currently in large volume manufacturing. Your expertise will primarily focus on CMOS technology with embedded features to support a range of applications including automotive, analog, and RF capabilities. This is a unique opportunity to contribute to the advancement of our installed semiconductor solutions that cater to diverse industry needs.

As a Process Integration Engineer your responsibilities will include but are not limited to:

  • Developing and enabling semiconductor logic technologies in large volume manufacturing for foundry customer use, focusing on CMOS technology with embedded features for range of applications including automotive, analog, and RF solutions.
  • Collaborate with cross-functional teams to understand customer requirements and translate them into tailored solutions.
  • Drive the development and implementation of customized semiconductor logic technologies, ensuring compatibility with Intel's existing manufacturing processes and platforms.
  • Provide technical guidance and mentorship to junior engineers and researchers, fostering a culture of continuous learning and development.
  • Stay updated with industry trends, emerging technologies, and customer needs to inform customization strategies and identify opportunities for improvement.

Behavioral traits that we are looking for:

  • Strong understanding of manufacturing processes and platforms, with experience in large volume manufacturing.
  • Excellent leadership skills with the ability to lead cross-functional teams and drive collaboration.
  • Excellent communication skills, with the ability to convey complex technical concepts effectively.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

  • Master's degree in one of the following disciplines: Electrical/Electronic Engineering, Physics, Chemistry, Materials Science, or in a (STEM) related major.
  • 7+ years of experience in semiconductor foundry -or- foundry interface, with a strong focus on technology development and, or customization.
  • Experience in advanced CMOS technology and its customization for automotive, analog, and RF applications.
  • Experience in foundry in developing and customizing logic technologies for specific customer requirements
  • Proven track record of as part of foundry in developing and customizing logic technologies for specific customer requirements.
  • Strong understanding of manufacturing processes and platforms, with experience in large volume manufacturing.
  • Exposure to the foundry ecosystem is a requirement.

Preferred Qualifications:

  • Experiencein 3nm-16nm FinFETs and sub 3nm GAA FETs.
  • Experience in in Yield Improvement and High-Volume Manufacturing
  • Experience in Power-performance optimization.
  • Experience in 3DIC development, including TSV (and interaction with CMOS, packaging)

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Other Locations

US, Hillsboro

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.Annual Salary Range for jobs which could be performed in the US $179,900.00-$253,980.00*Salary range dependent on a number of factors including location and experience

Working Model

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
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