NM IFS Integration Engineer
Job Description
Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors. The Disaggregated Manufacturing Organization (DMO) will play an important role in this strategy, with New Mexico Foundry Operations a key component of this effort. This is an Individual Contributor role in Integration Engineering and will cover one of the following areas: Front-End/Transistors Segments, Back-End/Interconnects Segments, or Contacts Segments. Responsibilities include the following but are not limited to: Process integration development. Technology transfer and startup. Task force leadership including Segment Team, Focus Team. Use Statistics, Data Mining, and other data analysis techniques to collect, explore, and extract insights from Electrical-test, yield, and fab data for new process qualifications and integrated issues. Planning and conducting experiments and data analysis to optimize and characterize new processes and understand sources of variation within the fab to improve process stability/capability. Developing solutions to problems utilizing formal education, statistical knowledge, experiment design, industry literature, and problem-solving tools. The ideal candidate will exhibit the following behavioral traits: Excellent communication skills and demonstrated ability to work across organizational boundaries to meet objectives and key results while fostering a challenging and positive work environment. Demonstrated track record of leading process integration and module engineering co-development. High tolerance of ambiguity demonstrated flexibility and adaptability in a fast-changing environment. Must be a self-starter, highly organized, and have the ability to work independently across organizations. Lead problem-solving efforts with creativity and out-of-box thinking as well as future, strategic, and possibility thinking. Full time onsite required during training, estimated 6 months. After training: hybrid "work from home" to be defined by manager and employee but continued onsite will be required. Relocation assistance provided.Qualifications
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.Minimum Qualifications
- The candidate must possess a Bachelor's, Master's, or Ph.D. degree in Engineering, Physics, Electrical Engineering, Chemistry, Material Science, or a related field.
- Bachelor’s degree (BS) with 4+ years of experience in a combination of experience listed belowMaster’s degree (MS) with 3+ years of experience in a combination of experience listed belowPhD with 1+ years of experience in a combination of experience listed below
Experience:
- Semiconductor materials
- Fabrication
- Electrical characterization
- Device physics
- Statistical Process Control (SPC)
- Design of Experiments (DOE) principles
- Engineering analysis tools
- OR in lieu of degree, 7+ years of direct wafer fabrication and high volume factory experience in a process integration or yield role.
Candidate must be willing to relocate to NM.This position is not eligible for Intel immigration sponsorship.Preferred Qualifications:
Detailed understanding of Model Based Problem Solving (MBPS) as well as fab process control systems and methodologies.Working knowledge of device physics and process technologies.Semiconductor processing and device fabrication.Proven technical leadership skills with the ability to directly influence a diverse team of engineers.Process monitoring test structures design and layout experience.Expertise in database structures, research methods, machine learning, analytics packages (i.e., JMP, MATLAB, Octave), scripting languages (i.e., Python, JSL, Perl, TCL), or programming languages (i.e., SQL, C/C++).
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.Annual Salary Range for jobs which could be performed in the US $136,990.00-$193,390.00*Salary range dependent on a number of factors including location and experienceWorking Model
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
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