Front-End-Of-Line (FEOL) Process Integration Manager
Fab Sort Manufacturing (FSM) is responsible for the production of all Intel silicon using some of the world's most advanced manufacturing processes in fabs in Arizona, Ireland, Israel, Oregon and 2 new greenfield sites in Ohio and Germany. As part of Intel's IDM2.0 strategy, FSM is rapidly expanding its operation to deliver output for both internal and foundry customers with state-of-the-art technologies arriving in high-volume manufacturing at a 2-year cadence going forward. Intel recently created HVM Global Yield organization in FSM to strengthen its yield operation and enable fast-paced yield ramp-up in early HVM phases for each technology in collaboration with Technology Development team and FSM fab managers.
This job requisition is to seek FEOL (Front-End-Of-Line) Process Integration manager in FSM HVM Global Yield organization, reporting to Director of Process Integration Engineering (PIE). The selected candidate will build and lead a team in HVM Global Yield organization and work with other leaders in the org, fab module/yield managers and TD leaders to support yield ramp-up and process optimization in early production stage, supporting internal and external customers.
FEOL (Front-End-Of-Line) Integration Manager responsibilities include (but not limited to):
Build and lead FEOL Integration team in FSM HVM Global Yield organization to execute HVM yield roadmap, device targeting and attain performance targets.
Collaborate with FEOL Technology Development team to import new technology to production fabs across the globe.
Work with Technology Program managers, BEOL Integration, Device, Defect Reduction and Yield Analysis teams to identify root cause of yield/performance issues and propose mitigation plan in defined timeline to meet committed production yield/performance targets and to support fast paced yield ramp-up in high-volume manufacturing phases.
Lead NPI (New Product Introduction) in production fab and perform device-related process optimizations to meet foundry customers product specifications and requirements.
Develop a model to predict device performance accurately in early-to-mid stage of Si progression and drive systematic solution to improve device performance.
Drive Front End process simplification to identify and implement cost reduction engineering opportunities.
Support technical interactions with internal and external customers.
Candidates should have the following behavioral skills:
Problem-solving and project/program management experience with strong self-initiative and self-learning capabilities.
Demonstrated interpersonal skills to perform at leadership role including influencing, engaging, and motivating.
Proven track record of working across organization through matrix structures in order to accomplish strategic objectives with conflicting priorities.
Must demonstrate strong communication skills.
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Master's degree in Electrical Engineering, Physics or Materials Science major. Other related science and engineering degrees can be considered based on industry experience.
8+ years of experience in advanced node semiconductor industry in FEOL Process Integration.
3+ years of people leadership experience to manage and direct an organization of 20+ process integration engineers in fast-paced high-volume semiconductor manufacturing environment to drive yield, technology, quality, output and cost.
Must have solid understanding on Device Physics and experience in FinFET technology development or high-volume manufacturing.
Strong working knowledge in module processes including lithography, dry etch, wet etch, CMP, diffusion, implant, thin films and metrology.
Ph.D. in Electrical Engineering, Physics or Materials Science major. Other related science and engineering degrees can be considered based on industry experience.
Experience in serving external Foundry customers through technical interactions.
Experience in GAA (Gate-All-Around) technology architecture.
Experience in new semiconductor technology development.
Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Inside this Business GroupAs the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.
Posting StatementAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Working ModelThis role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.
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