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Firmware and Modeling Integration Engineering Manager

Phoenix, Arizona, Amerika Syarikat| Hillsboro, Oregon, Amerika Syarikat| Austin, Texas, Amerika Syarikat| Folsom, California, Amerika Syarikat| Santa Clara, California, Amerika Syarikat ID Pekerjaan JR0272984 Kategori Kerja Software Engineering Mod Kerja Hybrid Tahap Pengalaman Experienced Jenis Waktu Bekerja Sepenuh Masa
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Job Description

Join us to drive Intel's next generation of architectural breakthroughs. We are seeking a highly qualified candidate to lead our Firmware and Modeling Integration engineering team within a dynamic and forward-thinking organization. Our team is at the forefront of developing customer-led, cutting-edge technologies that drive the future of semiconductor product development. As a firmware engineering manager, you will be building a team responsible for defining our organization's approach to integration and validation of software for microcontroller firmware and hardware models across a variety of technologies. This opportunity will leverage your technical knowledge of the silicon design lifecycle and your strong focus on firmware and modeling. Your project and people management skills will elevate your team's ability to plan and execute product delivery.

If you are passionate about pushing the boundaries of technology, we want you on our team.

As aFirmware Engineering Manager  your responsibilities will include but are not limited to:

  • Lead, coach and build a collaborative, inclusive and high-performing team where members are set up to be successful and grow.
  • Lead the development and validation of the integration of Firmware for IPs and custom design modules into an SOC.
  • Lead the development and validation of functional model integration into larger components in various pre-si environments.
  • Drive industry leading software practices across various areas including continuous integration, debug infrastructure, bug tracking, and other software engineering infrastructure.
  • Manage delivery of firmware products and drive execution alignment with cross-functional teams, partner organizations, and external customers.
  • As a member of the leadership team, you will need to collaborate across multiple disciplines and organizations to effectively influence product direction.

The ideal candidate will exhibit the following :

  • Excellent leadership skills with the ability to lead cross-functional teams and drive collaboration.
  • Excellent communication skills, with the ability to convey complex technical concepts effectively.
  • Strong interpersonal skills with the ability and desire to collaborate and influence across disciplines
  • Self-directed with a desire to drive issues to conclusion taking ownership regardless of organizational structure and team boundaries.
  • Expert knowledge of software and firmware development practices with examples of high-volume product releases
  • Experience in System Software

Qualifications

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum qualifications:

  • Bachelor’s degree or Masters in Computer Science, Computer Engineering, Electrical Engineering, or equivalent
  • 10+ years of industry experience in firmware and/or silicon model development and/or validation in support of successfully deployed products.
  • 3+ years of Engineering Management experience

Preferred Qualifications:

  • Extensive experience in working with cross functional Platform, SoC, and/or IP teams including Architecture, Design, Firmware, and Validation in the development, validation or program management of high-volume production silicon or board-level products.
  • Experience working with validation practices in different environments, simulation, emulation and virtual prototype.
  • Software development in C, C++, Rust, SystemC, Python and/or Domain Specific Language modeling
  • Deep understanding of processors, servers, system software architecture, and associated Power and Performance modelling techniques
  • Detailed SoC Architecture, SoC Subsystem Architecture, IP Architecture and/or Microarchitecture knowledge

Inside this Business Group

The Data Center & Artificial Intelligence Group (DCAI) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.

Other Locations

US, OR, Hillsboro; US, TX, Austin; US, CA, Folsom; US, CA, Santa Clara

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.Annual Salary Range for jobs which could be performed in the US $196,830.00-$277,880.00*Salary range dependent on a number of factors including location and experience

Working Model

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
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