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Package designer/Architecture

Shanghai, China Job ID JR0231133 Job Category Engineering Work Mode On-site Required Experience Level Experienced
Job Description
Packaging Engineer/Architecture will play a critical role in Intel strategy by packaging architecture design, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. Responsible for but not limited to: Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design. Package designs and technology selection. Ensuring the thermal/mechanical/electrical design, affordability, performance, reliability and manufacturability analysis to meet product requirements Assess and mitigate risks associated with the product designs. Working with cross-functional groups to determine package requirements in order to meet electrical, optical, mechanical, thermal, and reliability requirements. Define and conduct overall tolerance analysis for component and sub-assemblies. Interact with suppliers and optimize designs based on supplier's processes and capabilities. Generate all component drawings, layouts, assembly drawings for product and tooling. The ideal candidate should exhibit the following behavioral traits: Highly collaborative that can effectively drive stakeholders to win results for Intel. Excel in leading in a highly matrixed development environment. Executes toward results with focus and a sense of urgency. Motivated individual with a can-do attitude.
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications: A Ph.D. or master degree in Electronics, Physics, Material science, microsystem technology or similar 10+ years of practical experience in assembly technologies preferred in package concept, design, simulation and packaging development area. 5+ years of hands-on experience with typical design tools (e.g. AutoCAD) Preferred Qualifications: Experience with design and design rules. Experience in advanced packaging technologies development or pathfinding Experience in virtual basic programming and CAD drawing Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Inside this Business Group
The Data Platforms Engineering and Architecture (DPEA) Group invents, designs & builds the world's most critical computing platforms which fuel Intel's most important business and solve the world's most fundamental problems. DPEA enables that data center which is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.

Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, and benefit programs. Find more information about our Amazing Benefits here:

Working Model
This role will require an on-site presence.
Maggie, Offensive Security Researcher

Maggie Offensive Security Researcher

“I’ve always wanted to do something that changes the world — at Intel, I feel appreciated, and I’ve gained more confidence in myself. It makes me feel like I’m capable of doing great things.”

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