NAND Lithography Principal Engineer (SK)
Intel's Non-Volatile Memory (NVM) Architecture and Technology Scaling (ATS) Process Engineering team focuses on enabling and securing the 3D NAND technology roadmap. This job requisition is seeking to hire an experienced IC to provide technical leadership in photolithography and spearhead supplier development and complex and cross-functional process and equipment development to meet targets for next generation 3D NAND device nodes. This job requires an experienced technical leader with deep technical understanding of lithography, understanding of multiple fab process areas and supplier management experience. The ideal candidate will have a successful track record of delivering cost-effective leading-edge technology and demonstrated collaboration with cross-functional/cross-company teams including equipment and material vendors.
The candidate will have the following job responsibilities and work with a world class technical team to deliver:
The selected candidate will partner with the Intel memory TD teams in the US and Dalian China to create leading edge 3D NAND process technology, new equipment selection, and ultimately transfer into the Intel TD/high volume fabrication site. Leading and conducting process, equipment and material development projects with equipment and material suppliers. This will involve exceptional collaboration with cross-functional/cross-company teams and tool vendors to meet challenging program goals. The candidate must have demonstrated leadership skills, including but not limited to process technology, quality, output, and cost. The candidate must have demonstrated the ability to solve highly complex technical problems with communication skills and the ability to motivate the organization.
The candidate must have demonstrated a track record of excellence in technical achievement, creative problem solving, enabling new semiconductor equipment capabilities, and process technology development for capability, world class cost and productivity. Recognized industry leader with demonstrated track record. Demonstrated experience as internal / external spokesperson regarding technology or strategy. Demonstrated experience with executive presentations. Demonstrated experience working with external and internal partners, including leading edge semiconductor equipment and/or materials manufacturers.
A fast learner, able to adapt to the culture and the technology Demonstrated results and accountability for broad leadership, building of followership and role modeling of Intel's cultural attributes of:
Customer obsessed - seek to understand what matters most to our customers, listening more and talking less.
One Intel - we before me. We work across boundaries, collaborating across the aisle and around the world.
Fearless - We are bold. We take risks and challenge ourselves. We fail fast, iterate and continuously improve.
Truth and Transparency - allows the best ideas to emerge and speeds our ability to solve problems faster.
Inclusion - Inclusion runs through each attribute and is integral to our culture evolution.
Quality - We deliver quality and ensure a safe workplace. We have the discipline to deliver products and services that our customers and partners can always rely on.
The ideal candidate should be able to:
Think and operate independently, while simultaneously focusing on many diverse priorities.
Flexibility and maturity in facing uncertainties and changing priorities/responsibilities
Commit to aggressive goals and win with a can-do attitude
Act with velocity and a strong sense of urgency
Respect cultural diversity and sensitivity
Agility in learning, improving, and innovating
This position is associated with the sale of the NAND business to SK Hynix aligning to Phase 2 of the transaction. Employees aligned to Phase 2 will continue to be employed by Intel developing NAND technology and components. Phase 2 of the transaction is expected to close in March 2025 at which time employees aligned to this phase of the transaction will transition employment to Solidigm, a stand-alone US subsidiary of SK Hynix headquartered in San Jose, California with offices world-wide. Solidigm is a leading global supplier of NAND flash memory solutions, led by Robert (Rob) B. Crooke as CEO, previously senior vice president and general manager of Intel's Non-Volatile Memory Solutions Group. To read more, see: https://www.intc.com/news-events/press-releases/detail/1513/intel-sells-ssd-business-and-dalian-facility-to-sk-hynix
MS in Electrical Engineering, Materials Sciences, Chemical Engineering or similar 10+ years of experience in semiconductor process research and development environment are required;
Broad and deep knowledge of Litho processes and equipment
Hands-on experience in technology development and technology transfer
PhD in Electrical Engineering, Materials Sciences, Chemical Engineering or similar
Experience in alignment and overlay
Motivated self-starter, with strong ability to work independently as well as in a team environment.
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