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Design Rule Architecture / Path Finding Eng (SK)

Santa Clara, California; ; Remote Job ID JR0234083 Job Category Engineering Work Mode Hybrid Experience Level Experienced
Job Description

This is an exciting time to be at Intel. Come join Intel 3D NAND Technology and Manufacturing (NAND-DTM) Group as a Product Development Engineer and work on one of the most advanced 3DNAND and SSD technology portfolios in the world.

As a global leader in the semiconductor industry, Intel possesses many industries leading SSD technologies including the most capable Quadruple Level Cell QLC Intel 3D NAND Technology Flash products.

Non-Volatile Memory Device and Integration engineers are responsible for leading research and development to architect, develop and deliver leading-edge nonvolatile memory technologies to high-volume manufacturing. They contribute to defining process and device architectures, and technology collaterals as well as develop scaling paths for leading-edge memory technologies.

The scope includes the development of new types of process and device architectures involving novel materials, structures, and integration schemes to deliver industry leadership in density, performance, reliability and cost. They collaborate with technology development partners in defining goals, developing the vision, aligning strategy, and driving fast-paced silicon development to meet aggressive technology node cadences. In addition, they work closely with the product and system teams to ensure seamless integration of the memory components into Intel's system products as well as with the manufacturing Fabs to ensure a seamless technology transfer and ramp to support the full envelope of components and system products.

This particular role's responsibilities include:

  • Architecture /Pathfinding activities to define and enable next-generation memory technologies Architect design rules ( Physical design rules, Electrical design rules, CMOS, array ) to enable best-in-class die size Interact and lead cross-functional groups in TD, design, DA, Rel to define pathfinding activities including test chip definitions, lead vehicle definitions and understand and support volume ramp.
  • Develop and maintain design rule document by having various interactions with process integration, die design, scribe design and CMOS and array device groups.
  • Use DF2, Cadence, K2View, Vcats, to develop and debug the rules.
  • Interact with CAD to debug the rules and come up with sanity checks to understand the interaction with various mask and base layers.
  • Help in updating the logic of the generators by studying the sizing tables and Calibre code.
  • Help in generating the Calibre code for the various sanity checks. Perform DRC checks, layout vs. schematic, and netlist extraction tools to ensure correctness in layout and also help inscribe test structures.
  • Interface with multiple other groups like Process Integration, Design Rules, CAD, Layout, Scribe, and Mask shops with patience and thoroughness.
  • Drive diagnostic projects across multi-disciplinary teams to understand the product and test structure failures and their interaction with layout and mask synthesized data.

The position is associated with the sale of the NAND business to SK Hynix aligning to Phase 2 of the transaction. Employees aligned to Phase 2 will continue to be employed by Intel developing NAND technology and components. Phase 2 of the transaction is expected to close in March 2025 at which time employees aligned to this phase of the transaction will transition employment to Solidigm, a stand-alone US subsidiary of SK Hynix headquartered in San Jose, California with offices world-wide. Solidigm is a leading global supplier of NAND flash memory solutions, led by Robert (Rob) B. Crooke as CEO, previously senior vice president and general manager of Intel’s Non-Volatile Memory Solutions Group. To read more, see: https://www.intc.com/news-events/press-releases/detail/1513/intel-sells-ssd-business-and-dalian-facility-to-sk-hynix


Qualifications

Minimum Qualifications:
Bachelor's degree in Electrical Engineering. Chemical Engineering, Computer Science or related discipline and 9+ years in the following:

  • Memory Design and architecture, Process architecture, Device development, Physical design, and verification sign-offs.
  • Design rules ( Physical, electrical) and silicon architecture experience.
  • CAD tools, methodology, and software, in particular DF2, Schematic and layout, K2view, and Calibre.


Preferred skills and experience:

Master's degree in Electrical Engineering. Chemical Engineering, Computer Science or related discipline and 6+ years in the minimum qualifications.

OR

Ph.D. degree in Electrical Engineering. Chemical Engineering, Computer Science or, related discipline and 4+ years in the minimum qualifications.

AND

  • Semiconductor device and design architecture.
  • Design methodology including Design Rule, and Schematic (DRC/LVS), can fix most design and DRC/LVS issues that come up; work with the LVS/DRC maintenance group to build new models as needed.
  • Experience with generators and how they are related to processes is helpful to fix any DRC/LVS issues.
  • Experience with device physics and parametric analysis.
  • Experience with photolithography and reticle creation.
  • Tape-out, OPC, and Mask Generation Flow or High volume manufacturing.
  • GDS2/SF/OASIS format and layout hierarchy and layer maps.
  • DFII, K2VIEW, and other Industry standard CD capture/measurement tools.

Inside this Business Group
Employees in Intel's NAND Product Group deliver solutions that are transforming computing across all segments from data centers to Ultrabooks. They invent, develop, bring to market and support customers with leading-edge NAND flash memory and system level solutions such as solid state drives (SSDs). SSDs are accelerating performance for gaming enthusiasts, reducing total cost of ownership for IT managers of data centers and improving security and reliability for businesses. This dynamic group is strategically positioned to become the leading Non-Volatile Memory solution supplier for the compute segment and is a key to expanding markets and continuing the growth for Intel.

Other Locations

US,Virtual


Covid Statement
Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, and benefit programs. Find more information about our Amazing Benefits here: https://www.intel.com/content/www/us/en/jobs/benefits.html

Annual Salary Range for jobs which could be performed in US, Colorado:$130,190.00-$221,610.00

Working Model
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.
Maggie, Offensive Security Researcher

Maggie Offensive Security Researcher

“I’ve always wanted to do something that changes the world — at Intel, I feel appreciated, and I’ve gained more confidence in myself. It makes me feel like I’m capable of doing great things.”

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