Failure Analysis R and D Engineer
The team provides fundamental root cause analysis of yield and reliability issues supporting Intel's package technology development and develops industry leading state of art analytical capabilities supporting Intel's package technology roadmap.
The selected candidate will be responsible for identifying component failures and researching process/materials improvements to enhance yield, performance, quality and reliability of next generation Product and Package technologies.
Technical leadership in driving solutions to complex package assembly interaction issues through cross collaboration across multi-disciplinary teams.
Drive capability roadmap by owning development of innovative fault isolation and failure analysis methods to accelerate failure identification and mechanism understanding on future technologies and products.
Experience in lab management and supplier engagement and management is a plus.
Conduct hands on lab work, define failure analysis strategy, evaluate the electrical and thermal mechanical characteristics of integrated circuits to determine the root cause of failures and recommend corrective actions working with cross functional teams.
Drives technology transfer to high volume manufacturing and owns proliferation of shared learning across sites.
Mentor junior engineers and technicians.
Communication and decision-making skills.
Team player, assumes ownership of issues and is self-driven, willing to deliver results under pressure in a fast-paced environment.
Organized and pays attention to detail.
Planning/time management skills with willingness to work in ambiguous situations and work across multiple projects.
Familiarity with packaging materials, assembly process, design of experiments, and data analysis
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Candidate must possess a Ph.D. Degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemistry, Physics or related fields with 5+ years of relevant experience ideally in semiconductor packaging.
Ph.D. Degree with 10+ years of experience ideally in semiconductor packaging and expertise in one or more areas below:
Semiconductor fabrication and device physics, Electron microscopy, Polymer materials, Metallurgy, Mechanical behavior of materials, Surface analysis, and Reliability statistics.
Electrical Fault Isolation, advanced imaging techniques, nondestructive and destructive failure analysis methods, material analysis and characterization methods.
Exposure and software skills (Power BI, Python, Java, Tensor Flow) preferred.
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