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Failure Analysis R and D Engineer

Phoenix, Arizona Job ID JR0230811 Job Category Engineering Work Mode On-site Required Experience Level Experienced
Job Description

The team provides fundamental root cause analysis of yield and reliability issues supporting Intel's package technology development and develops industry leading state of art analytical capabilities supporting Intel's package technology roadmap.

The selected candidate will be responsible for identifying component failures and researching process/materials improvements to enhance yield, performance, quality and reliability of next generation Product and Package technologies.

  • Technical leadership in driving solutions to complex package assembly interaction issues through cross collaboration across multi-disciplinary teams.

  • Drive capability roadmap by owning development of innovative fault isolation and failure analysis methods to accelerate failure identification and mechanism understanding on future technologies and products.

  • Experience in lab management and supplier engagement and management is a plus.

  • Conduct hands on lab work, define failure analysis strategy, evaluate the electrical and thermal mechanical characteristics of integrated circuits to determine the root cause of failures and recommend corrective actions working with cross functional teams.

  • Drives technology transfer to high volume manufacturing and owns proliferation of shared learning across sites.

  • Mentor junior engineers and technicians.

  • Communication and decision-making skills.

  • Team player, assumes ownership of issues and is self-driven, willing to deliver results under pressure in a fast-paced environment.

  • Organized and pays attention to detail.

  • Planning/time management skills with willingness to work in ambiguous situations and work across multiple projects.

  • Familiarity with packaging materials, assembly process, design of experiments, and data analysis


Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

  • Candidate must possess a Ph.D. Degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemistry, Physics or related fields with 5+ years of relevant experience ideally in semiconductor packaging.


Preferred Qualifications:
Ph.D. Degree with 10+ years of experience ideally in semiconductor packaging and expertise in one or more areas below:

  • Semiconductor fabrication and device physics, Electron microscopy, Polymer materials, Metallurgy, Mechanical behavior of materials, Surface analysis, and Reliability statistics.

  • Electrical Fault Isolation, advanced imaging techniques, nondestructive and destructive failure analysis methods, material analysis and characterization methods.

  • Exposure and software skills (Power BI, Python, Java, Tensor Flow) preferred.


Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.


Covid Statement
Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, and benefit programs. Find more information about our Amazing Benefits here: https://www.intel.com/content/www/us/en/jobs/benefits.html

Working Model
This role will require an on-site presence.
Maggie, Offensive Security Researcher

Maggie Offensive Security Researcher

“I’ve always wanted to do something that changes the world — at Intel, I feel appreciated, and I’ve gained more confidence in myself. It makes me feel like I’m capable of doing great things.”

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