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Penang Advanced Packaging Process Engineer

Malaysia Job ID JR0234696 Job Category Engineering Work Mode On-site Required Experience Level Experienced
Job Description

Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors.

The Disaggregation Manufacturing Organization (DMO) will play an important role in this strategy, leveraging Intel's Advanced Packaging technology portfolio to deliver leadership products. To enable this ramp, DMO is building an Advanced Packaging manufacturing facility in Malaysia, increasing its investment in this region which has been a critical part of Intel's supply chain for nearly five decades.

Join the Intel Malaysia Advanced Packaging team where you will be instrumental in developing and ramping some of Intel's newest Advanced Packaging technologies and help us realize Intel's vision to create and extend computing technology to connect and enrich the lives of every person on Earth.

Responsibilities will include, but are not be limited to:

  • Ramping Intel's latest technologies from process startup to high volume manufacturing.
  • Partnering with the production management team to deliver world class performance on critical success indicators (Safety, Quality, Output and Equipment performance) in a highly automated production facility.
  • Working alongside our 24/7 technician team to troubleshoot equipment and process issues to support sustaining operations.
  • Using data extraction, datamining and analysis skills to identify trends/outliers to reduce process variation and drive corrective action plans.
  • Developing solutions to problems utilizing statistical knowledge and problem-solving tools as well as developing strategies to prevent the recurrence of the problem in future.
  • Interacting with partner factories worldwide to transfer new processes, maintain CE (copy exactly) parameters, share learnings and drive improvements.
  • Actively participating in technician and engineer training to further the technical development of the entire workforce.

The ideal candidate should exhibit the following behavioral traits:

  • Places high priority on the safety of themselves and those around them.
  • Excellent communication skills with a high tolerance for ambiguous and changing situations.
  • Strong technical and troubleshooting skills and a desire to learn new processes and tools.
  • Willingness to complete an extended SEED relocation assignment in the US to learn the new technologies and process equipment.
  • Capable of making informed technical decisions and providing direction.
  • Ability to work well in a matrixed environment and build cohesive teams.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Qualifications listed as preferred or additional will be considered a plus factor for applicants.

Minimum Requirements:

  • Candidate must possess a Bachelor's or Master's degree in Electrical Engineering, Chemical Engineering, Mechanical Engineering, Materials Science, Physics, Optics, Chemistry, or related field of study.


Preferred qualifications:

  • 5+ years of experience in manufacturing or engineering environment.
  • Knowledge of statistics and experimental design; and the skills to apply that knowledge to tool matching, tool qualification, and process development.
  • For this role, we are looking for candidates who have experienced in Lithography, Dry and Wet Etch, Plating, Dielectric and Films, Planar, Defect Metrology to join and be part of the team.

Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.


Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, and benefit programs. Find more information about our Amazing Benefits here: https://www.intel.com/content/www/us/en/jobs/benefits.html

Working Model
This role will require an on-site presence.
Maggie, Offensive Security Researcher

Maggie Offensive Security Researcher

“I’ve always wanted to do something that changes the world — at Intel, I feel appreciated, and I’ve gained more confidence in myself. It makes me feel like I’m capable of doing great things.”

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