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Advanced Packaging at Penang - Bond/Debond Engineering Manager

Malaysia; Shanghai, China; Shenzhen, China; Beijing, China; Chengdu, China; Dalian, China; Leixlip, Ireland; Shannon, Ireland; Singapore, Singapore; Hsinchu, Taiwan; Taipei, Taiwan; Hanoi, Vietnam; Ho Chi Minh City, Vietnam Job ID JR0234694 Job Category Engineering Management Work Mode On-site Required Experience Level Experienced
Job Description

Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors. The Disaggregated Manufacturing Organization (DMO) will play an important role in this strategy, leveraging Intel's Advanced Packaging technology portfolio to deliver leadership products.

To enable this ramp, DMO is building an Advanced Packaging manufacturing facility in Malaysia, increasing its investment in this region which has been a critical part of Intel's supply chain for nearly five decades. Join the Intel Malaysia Advanced Packaging team where you will be instrumental in developing and ramping some of Intel's newest Advanced Packaging technologies and help us realize Intel's vision to create and extend computing technology to connect and enrich the lives of every person on Earth.

Disaggregation Manufacturing Organization (DMO) is responsible for enabling and ramping modular manufacturing, which is a critical capability for Intel's leadership products. The project will include 2 types of factories: Advanced Packaging and Bump/Interposer. The Bump/Interposer factory includes the following activities: Passive Interposer (PI), TSV patterning and TSV reveal (TSV- through Si Via) and C4.

This area will focus on bond and de-bond equipment and process. The candidate will be reporting to Wafer Level Assembly Department Manager.

The candidate will be responsible for but not limited to:

  • New technology process transfer and matching to ensure successful startup and ramp to high volume manufacturing (HVM).
  • Must build a proficient engineering department to run process control and tool maintenance activity.
  • Demonstrate leadership skills to enable the organization to meet expectations around safety, quality, output, and affordability.
  • The department manager must have sufficient technical knowledge to provide clear management direction for daily operations/maintenance, process engineering prioritization, yield improvement and manufacturing efficiency improvement.
  • As a member of the factory staff, will also be responsible for influencing efforts toward improving overall organizational culture and operation effectiveness.
  • The candidate will also be responsible for people and leadership development to grow the organizational capability and must have a proven track record in managing people and the ability to build a compelling vision and mission for the organization and get the direct leaders and employees aligned to this direction.


The candidate should exhibit the following behavioral traits:

  • To be a self-starter, highly organized, and have an ability to work independently across organizations.
  • Has a proven track record as a strong leader with high technical and analytical skills.
  • Has strong knowledge in structured problem-solving methods, a good understanding of statistical data analysis and techniques, planning and prioritization, influencing others, and strong communication skills.
  • Is a team player with a high level of synergy w/ virtual factory peers, stakeholders and customers
  • Is proficient in the fundamentals of factory operations, process/materials/equipment interaction, change control, pcs, and quality systems.
  • Skills in leading and developing individuals, managers, and teams.
  • Skills to provide technical and tactical direction.


Relocation is applicable for interested and qualified candidates currently based outside of Malaysia.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Qualifications listed as preferred or additional will be considered a plus factor for applicants.

Minimum Requirements:

  • Candidate must possess a Bachelor's or Master's degree in Chemical Engineering, Mechanical Engineering, Materials Science, Physics, Optics, Laser, Chemistry, or related field of study.
  • 8+ years of experience in manufacturing or engineering environment.
  • 8+ years of experience in direct managing of a team 10+
  • 5+ years of experience in glass bonding as well as de-bonding

Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Other Locations

CN,SH,Shanghai;CN,GD,Shenzhen;CN,BJ,Beijing;CN,SC,Chengdu;CN,LN,Dalian;SG,01,Singapore;TW,HSZ,Hsinchu;TW,TPE,Taipei;VN,HN,Hanoi;VN,SG,Ho Chi Minh City


Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, and benefit programs. Find more information about our Amazing Benefits here: https://www.intel.com/content/www/us/en/jobs/benefits.html

Your privacy matters to Intel and we comply with applicable data protection laws. We collect and maintain personal information for recruitment related activities and your data will not be used for any other purpose. We retain personal information for the periods and purposes set forth in Intel Privacy Notice. Retention periods can vary significantly based on the type of information and how it is used. We do not share your personal information with third parties. In order for Intel to communicate with you on your application results, by submitting your information and proceeding with this application, you agree and consent that we can collect your personal information. You will have the ability to opt-out by informing vietnamjobs@intel.com or at any time selecting unsubscribe found at the bottom of our future marketing communications. You have rights to correct, update, request access to or deletion of your personal information as described in Intel Privacy Notice. In addition, if you wish to update or otherwise make changes to your resume, use Intel online application tool to resubmit a new resume.

Working Model
This role will require an on-site presence.
Maggie, Offensive Security Researcher

Maggie Offensive Security Researcher

“I’ve always wanted to do something that changes the world — at Intel, I feel appreciated, and I’ve gained more confidence in myself. It makes me feel like I’m capable of doing great things.”

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