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NPI Manager

Hsinchu, Taiwan Job ID JR0210506 Job Category Engineering Management Work Mode Hybrid Experience Level Experienced
Job Description

Description

  • Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors.
  • The external Packaging and Assembly Engineering team (EPAE) will play a critical role in this strategy, leveraging external assembly technologies to deliver leadership products
  • Seeking a manager to lead the external New Product Introduction team through technical expertise demonstrating management values. With the key objectives to manage a global team which will qualify Intel's products at an external supplier according requirements guaranteeing a stable process window to support demand with high yielding production.
  • Build a strong and intimate relationship with the team and divisions across multiple levels and organizations, timely execute/drive established tasks in close collaboration with the platform manager and partner teams.
  • Strongly collaborate with platform management and manufacturing teams. Direct influence product programs through broad experience and expertise.
  • The ideal candidate should exhibit the following behavioral traits:
  • Motivated self -driven person with strong social skills to lead a team with diverse background
  • Excellent listening, written and verbal communication, tolerance of ambiguity, and commitment to tasks.
  • Skills to address complex problems and find solutions.
  • Highly collaborative that can effectively drive stakeholders to win results for Intel.
  • Excel in leading in a highly matrixed development environment.
  • Executes toward results with focus and a sense of urgency.
  • Motivated individual with a can-do attitude.
  • Is willing to take informed risks to achieve desired team goals.

Qualifications

Qualification

  • Ph.D. in Mechanical Engineering, Materials Science, Physics, Electrical Engineering or similar degree with focus on micro-electronics, electronic package, or semiconductors.


Work Experience

  • 15+ years' experience working in Semiconductor Packaging within a technology development or new product development environment.
  • 6+ year experience in leading global teams
  • Preferred experience working on new product introductions, in particular in assembly



Skills/Knowledge

  • Knowledge of resource and budget planning
  • Knowledge of supply chain business processes
  • Knowledge of NPI development process
  • Knowledge in leading multi-cultural globally distributed teams
  • Knowledge in project management
  • Knowledge of assembly processes and substrate fabrication processes
  • Knowledge of cost modelling and impact of processes on cost structure
  • Understanding of reliability failure modes in semiconductor processing and electronic packaging, inclusive of die to package interaction failures.
  • Excellent problem solving, communication and presentation skills
  • Ability to drive results across organizational boundaries. lead and work with teams spread across different geographies

Inside this Business Group
Intel's Sales and Marketing (SMG) organization works with global customers and partners to solve critical business problems with Intel based technology solutions. SMG works across business units to amplify the customer voice and deliver solutions that accelerate their business. We work across numerous industries, including retail, enterprise and government, cloud services and healthcare as examples. The operations team focuses on forecasting, driving alignment with factory production and delivering efficiency tools and our marketing capability drives demand and localized marketing in locations around the globe. Our sales force navigates a complex partner and customer ecosystem while shaping product roadmaps, driving value for our customers, and collaborating to harness emerging technology trends to deliver comprehensive solutions.


Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, and benefit programs. Find more information about our Amazing Benefits here: https://www.intel.com/content/www/us/en/jobs/benefits.html

Working Model
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.
Maggie, Offensive Security Researcher

Maggie Offensive Security Researcher

“I’ve always wanted to do something that changes the world — at Intel, I feel appreciated, and I’ve gained more confidence in myself. It makes me feel like I’m capable of doing great things.”

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